參數(shù)資料
型號: ISP1521
廠商: NXP Semiconductors N.V.
英文描述: Hi-Speed Universal Serial Bus hub controller
中文描述: 高速通用串行總線控制器樞紐
文件頁數(shù): 51/53頁
文件大?。?/td> 270K
代理商: ISP1521
Philips Semiconductors
ISP1521
Hi-Speed USB hub controller
Product data
Rev. 03 — 24 November 2004
51 of 53
9397 750 13702
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
[9]
21. Revision history
Table 48:
Rev
03
Revision history
CPCN
20041124
Date
Description
Product data (9397 750 13702)
Modifications:
Globally changed the temperature range from “0
°
C to +70
°
C” to “
40
°
C to +70
°
C”
Globally changed the ADOC pin connection from “3.3 V” to “3.3 Vor 5.0 V”
Table 34 “Absolute maximum ratings”
: changed the max value of V
REF(5V0)
from
5.25 V to 6.0 V
Table 35 “Recommended operating ranges”
: changed the max value of V
REF(5V0)
from
5.25 V to 5.5 V
Figure 19 “Self-powered hub; individual port power switching; individual overcurrent
detection.”
: changed pin SP/BP_N to TEST_HIGH and pin HP to TEST_LOW
Figure 20 “Self-powered hub; ganged port power switching; global overcurrent
detection.”
: changed pin SP/BP_N to TEST_HIGH and pin HP to TEST_LOW.
Product data (9397 750 11691)
Preliminary data (9397 750 10691)
200411024
02
01
20040212
20030625
-
-
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