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參數資料
| 型號： | ISP1520BD |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 總線控制器 |
| 英文描述： | Hi-Speed Universal Serial Bus hub controller |
| 中文描述： | UNIVERSAL SERIAL BUS CONTROLLER, PQFP64 |
| 封裝： | 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64 |
| 文件頁數： | 47/51頁 |
| 文件大?。?/td> | 259K |
| 代理商： | ISP1520BD |
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Philips Semiconductors
ISP1520
Hi-Speed USB hub controller
Product data
Rev. 02 — 04 May 2004
47 of 51
9397 750 11689
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
20. Soldering
20.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended. In these situations
reflow soldering is recommended.
20.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270
°
C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
20.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| ISP1520BD,518 | 功能描述:USB 接口集成電路 USB2 4 PORT HUB RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1520BD,551 | 功能描述:USB 接口集成電路 USB2 4-PORT HUB CTRLR RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1520BD,557 | 功能描述:USB 接口集成電路 DO NOT USE ORDER -S OR -T PART RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數據速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1520BD518 | 制造商:ST-Ericsson 功能描述:IC CONTROLLER USB HUB 64-LQFP |
| ISP1520BDGA | 功能描述:IC USB HUB CONTROLLER HS 64-LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標準包裝:3,000 系列:- 應用:PDA，便攜式音頻/視頻，智能電話 接口:I²C，2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應商設備封裝:24-QFN 裸露焊盤（4x4） 包裝:帶卷 (TR) 安裝類型:表面貼裝 產品目錄頁面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2 |
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