參數(shù)資料
型號(hào): ISP1106DH
廠商: NXP SEMICONDUCTORS
元件分類: 通用總線功能
英文描述: GT 10C 10#16 SKT PLUG
中文描述: LINE TRANSCEIVER, PDSO16
封裝: 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
文件頁(yè)數(shù): 21/24頁(yè)
文件大?。?/td> 588K
代理商: ISP1106DH
Philips Semiconductors
ISP1105/1106/1107
Advanced USB transceivers
Product data
Rev. 06 — 30 November 2001
21 of 24
9397 750 08872
Koninklijke Philips Electronics N.V. 2001. All rights reserved.
15. Additional soldering information
15.1 (H)BCC packages: footprint
The surface material of the terminals on the resin protrusion consists of a 4-layer
metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1
μ
m min.) ensures
solderability, the Ni layer (5
μ
m min.) prevents diffusion, and the Pd layer on top
(0.5
μ
m min.) ensures effective wire bonding.
15.2 (H)BCC packages: reflow soldering profile
The conditions for reflow soldering of (H)BCC packages are as follows:
Preheating time
: minimum 90 s at T = 145 to 155
°
C
Soldering time
: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183
°
C
Peak temperature
:
Ambient temperature: T
amb(max)
= 260
°
C
Device surface temperature: T
case(max)
= 255
°
C.
Cavity
: exposed diepad, either functioning as heatsink or as ground connection; only for HBCC packages.
Fig 15. (H)BCC footprint and solder resist mask dimensions.
004aaa123
b1
b
b2
Dh
0.05
All dimensions in mm
For exact dimensions
see package outline
drawing (SOT639-2)
Normal
Terminal
PCB land
Solder resist mask
Stencil mask
Solder land
Corner
0.05
b2
b2
b2
Eh
0.05
0.05
0.05
0.05
0.05
0.1
(4
×
)
0.3 (8
×
)
0.05
Solder resist
Solder stencil
b1
b
Stencil print thickness:
0.1 to 0.12 mm
Cavity
0.05
0.05
Dh
Eh
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ISP1106W 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Advanced Universal Serial Bus transceivers