參數資料
型號: ISL98003CNZ-150
廠商: Intersil
文件頁數: 25/31頁
文件大?。?/td> 0K
描述: IC AFE 3CH 8BIT 150MHZ 80EPTQFP
標準包裝: 119
位數: 8
通道數: 3
功率(瓦特): 1.1W
電壓 - 電源,模擬: 1.8V,3.3V
電壓 - 電源,數字: 1.65 V ~ 2 V
封裝/外殼: 80-TQFP 裸露焊盤
供應商設備封裝: 80-TQFP-EP(12x12)
包裝: 托盤
31
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6760.0
September 12, 2008
ISL98003
Thin Plastic Quad Flatpack Exposed Pad Packages (EPTQFP)
12° ALL AROUND
1
80
B
EXPOSED
PAD AREA
PIN 1
12° ALL AROUND
Y
PIN 1
BOTTOM VIEW
SIDE VIEW
TOP VIEW
E
E1
D
D1
9.500 REF
12.000±0.100
11.950±0.100
REF. 6.000
PLANE
SEATING
C
ddd
R0.250 TYP
cc
c
GAGE
PLANE
R0.080~0.200
ALL AROUND
0° MIN.
0.200 MIN.
R0
.08
0 MI
N.
0.250
L
C
A1
e
A
A2
b
L1
a
DETAIL "Y"
Q80.12x12
80 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD
PACKAGE
SYMBOL
MILLIMETERS
REMARKS
MIN
TYP
MAX
A
-
1.20
Overall height
A1
0.05
0.10
0.15
Standoff
A2
0.90
1.00
1.10
Package thickness
D
13.8
14.0
14.2
Lead tip to tip
D1
11.9
12.0
12.1
Package length
E
13.8
14.0
14.2
Lead tip to tip
E1
11.9
12.0
12.1
Package width
L
0.45
0.60
0.75
Foot length
L1
1.000 REF.
Lead length
T
0.09
0.150
0.20
Lead thickness
T1
0.097
0.127
0.157
Lead base metal thickness
a
0°~7°
Foot angle
b
0.17
0.22
0.27
Lead width
b1
0.17
0.20
0.23
Lead base metal width
e
0.500 BASE
Lead pitch
ccc
-
0.080
-
Foot coplanarity
ddd
-
0.080
-
Foot position
Rev. 0 8/07
NOTES:
1. General tolerance. Distance: ±0.1000, Angle: ±2.5°
2. Matte finish on package body surface except ejection and pin 1
marking: Ra0.8~2.0um
3. All molded body sharp corner radii unless otherwise specified:
MAX. R0.200
4. Package/lead frame misalignment (X, Y): MAX. 0.127
5. Top/bottom package misalignment (X, Y): MAX. 0.127
6. Drawing does not include plastic or metal protrusion or cutting
burr.
7. Compliant to JEDEC standard MS-026.
T
T1
SECTION B-B
b
b1
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