FN6190.0 November 3, 2005 Absolute Maximum Ratings Thermal Information V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ." />
參數(shù)資料
型號(hào): ISL84684IIEVAL1
廠商: Intersil
文件頁數(shù): 5/11頁
文件大?。?/td> 0K
描述: EVAL BOARD 1 FOR ISL84684II
標(biāo)準(zhǔn)包裝: 1
系列: *
3
FN6190.0
November 3, 2005
Absolute Maximum Ratings
Thermal Information
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +5V
Input Voltages
NO, NC, IN (Note 2) . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Output Voltages
COM (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Continuous Current NO, NC, or COM . . . . . . . . . . . . . . . . .
±300mA
Peak Current NO, NC, or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . .
±500mA
ESD HBM rating (Per Mil-Std-883, Method 3015) . . . . . . . . . .
±2kV
Thermal Resistance (Typical, Note 3)
θJA (°C/W)
10 Ball Chipscale Package . . . . . . . . . . . . . . . . . . .
91
Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to 150°C
Soldering conditions (Note 4) . . . . . . . . . . . . . . . . . . per J-STD-020
Operating Conditions
Temperature Range
ISL84684II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on NC, NO, IN, or COM exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings.
3.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
4. Permitted soldier profiles are limited to only those recommended in the industry standard specification, JEDEC J-STD-020. Preheating is
required. Hand or wave soldering is not allowed. See Technical Brief TB451.
Electrical Specifications - 3V Supply
Test Conditions: V+ = +2.7V to +3.3V, GND = 0V, VINH = 1.4V, VINL = 0.5V (Notes 5, 7)
Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
TEMP
(°C)
(NOTE 6)
MIN
TYP
(NOTE 6)
MAX
UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
Full
0
-
V+
V
ON Resistance, RON
V+ = 2.7V, ICOM = 100mA, VNO or VNC = 0V to V+,
(See Figure 5, Note 9)
25
-
0.21
0.5
Full
-
0.5
RON Matching Between Channels,
RON
V+ = 2.7V, ICOM = 100mA, VNO or VNC = Voltage at
max RON (Note 9, Note 10)
25
-
0.05
0.06
Full
-
0.09
RON Flatness, RFLAT(ON)
V+ = 2.7V, ICOM = 100mA, VNO or VNC = 0V to V+
(Note 8, Note 9)
25
-
0.03
0.2
Full
-
0.2
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 3.3V, VCOM = 0.3V, 3V, VNO or VNC = 3V, 0.3V
25
-40
-
40
nA
Full
-150
-
150
nA
COM ON Leakage Current,
ICOM(ON)
V
+ = 3.3V, VCOM = 0.3V, 3V, or VNO or VNC = 0.3V, 3V,
or Floating
25
-40
-
40
nA
Full
-150
-
150
nA
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
V+ = 2.7V, VNO or VNC = 1.5V, RL = 50, CL = 35pF
(See Figure 1, Note 9)
25
-
43
50
ns
Full
-
60
ns
Turn-OFF Time, tOFF
V+ = 2.7V, VNO or VNC = 1.5V, RL = 50, CL = 35pF
(See Figure 1, Note 9)
25
-
27
30
ns
Full
-
40
ns
Break-Before-Make Time Delay, tD
V+ = 3.3V, VNO or VNC = 1.5V, RL = 50, CL = 35pF
(See Figure 3, Note 9)
Full
2
12
-
ns
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0, (See Figure 2)
25
-
200
-
pC
OFF Isolation
RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS,
(See Figure 4)
25
-
56
-
dB
Crosstalk (Channel-to-Channel)
RL = 50, CL = 5pF, f = 100kHz, VCOM = 1VRMS,
(See Figure 6)
25
-
-105
-
dB
Total Harmonic Distortion
f = 20Hz to 20kHz, VCOM = 2VP-P, RL = 32
25
-
0.012
-
%
f = 1kHz, VCOM = 2VP-P, RL = 32
25
-
0.009
-
%
f = 1kHz, VCOM = 2VP-P, RL = 600
25
-
0.006
-
%
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V (See Figure 7)
25
-
140
-
pF
COM ON Capacitance, CCOM(ON) f = 1MHz, VNO or VNC = VCOM = 0V (See Figure 7)
25
-
355
-
pF
ISL84684II
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