2 FN7442.8 October 31, 2011 Pin Configuration ISL59885 (8 LD SOIC) TOP VIEW COMPOSITE SYNC OUT COMPOSITE VIDEO IN VERTICAL SYNC OUT GN" />
參數(shù)資料
型號(hào): ISL59885IS-T7
廠商: Intersil
文件頁數(shù): 8/15頁
文件大小: 0K
描述: IC SYNC SEPARATOR HD/SD 8-SOIC
標(biāo)準(zhǔn)包裝: 1,000
類型: 同步分離器
應(yīng)用: HD 視頻
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOICN
包裝: 帶卷 (TR)
ISL59885
2
FN7442.8
October 31, 2011
Pin Configuration
ISL59885
(8 LD SOIC)
TOP VIEW
COMPOSITE SYNC OUT
COMPOSITE VIDEO IN
VERTICAL SYNC OUT
GND
VDD
HORIZONTAL OUTPUT
CSET
HD
1
2
3
4
8
7
6
5
Pin Descriptions
PIN
NUMBER
PIN NAME
PIN FUNCTION
1Composite
Sync Out
Composite sync pulse output; sync pulses
start on a falling edge and end on a rising
edge.
2Composite
Video In
AC-coupled composite video input; sync tip
must be at the lowest potential (positive
picture phase).
3Vertical
Sync Out
Vertical sync pulse output; the falling edge
of vertical sync is the start of the vertical
period.
4
GND
Supply ground
5HD
Low when input horizontal frequency is
greater than 25kHz.
6
CSET
(An external capacitor to ground); bypass
pin for internal bias generator.
7
Horizontal
Output
Horizontal output; falling edge active
8
VDD
Positive supply
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART MARKING
TEMP RANGE
(°C)
PACKAGE
(Pb-free)
PKG. DWG. #
ISL59885ISZ
59885 ISZ
-40 to +85
8 Ld SOIC
M8.15E
ISL59885ISZ-EVAL
Evaluation Board
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL59885. For more information on MSL, please see Tech Brief TB363.
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