FN7432.7 October 26, 2011 ISL59532 Package Outline Drawing V356.27x27C 356 BALL HEATSINK PLASTIC BALL GRID ARRAY PACKAGE (HPBGA) Rev 1, " />
參數(shù)資料
型號(hào): ISL59532IK-EVAL
廠商: Intersil
文件頁數(shù): 18/25頁
文件大小: 0K
描述: EVAL BOARD FOR ISL59532
標(biāo)準(zhǔn)包裝: 1
系列: *
25
FN7432.7
October 26, 2011
ISL59532
Package Outline Drawing
V356.27x27C
356 BALL HEATSINK PLASTIC BALL GRID ARRAY PACKAGE (HPBGA)
Rev 1, 6/10
NON SOLDERMASK DEFINED PADS.
1.27
SOLDERMASK OPENING = 0.67MM (TYP x356)
PAD DIAMATER = 0.55MM (TYP X356)
registered outline MS-034/A variation BAL-2.
A1 ball pad corner I.D. for plate mold: To be marked by ink.
Reference specifications: This drawing conforms to JEDEC
crowns of the solder balls.
Primary datum C and seating plane are defined by the spherical
All dimensions and tolerances conform to ASME Y14.5m-1994.
6.
3 .
5.
4.
1.
Dimensions are in millimeters.
2.
NOTES:
BOTTOM VIEW
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
B
4X 45°
EXPOSED HEAT SPREADER
A1 BALL PAD
5.
A1 BALL
0.20 (4X)
A
0.56 ±0.06
1.17±0.05
0.60±0.10
2.33 ±0.21
SEATING PLANE
4.
0.35 C
0.25 C
C
30° TYP
0.30 M C A B
3.
0.15 C
24.00+0.35
-0.05
4X 10.00
27.00
24.00+0.35
-0.05
4X 10.00
27.00
0.76 +0.14
-0.16
(1.44)
1.27
3X R0.50
Y
W
V
U
T
R
P
N
1.27
20
14
17
18
19
16
15
11
13
12 10
9
D
H
K
L
M
J
F
G
E
7
864
5 3
B
C
A
2
1
16.8 AVAILABLE MARKING AREA
PAD CORNER
INDICATOR, 1.0
DIA., OPTIONAL
CHAMFER
0.15 M C
Dimension is measured at the maximum solder ball diameter,
parallel to primary datum C.
Auto mold: Dimple to be formed by mold cap.
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