- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄8525 > ISL59445IRZ-T7 (Intersil)IC AMP TRIPLE MUX 1GHZ 32-QFN PDF資料下載
參數(shù)資料
| 型號： | ISL59445IRZ-T7 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 2/14頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP TRIPLE MUX 1GHZ 32-QFN |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 應(yīng)用： | 4:1 多路復(fù)用器-放大器 |
| 電路數(shù)： | 3 |
| -3db帶寬： | 1GHz |
| 轉(zhuǎn)換速率： | 1200 V/µs |
| 電流 - 電源： | 53mA |
| 電流 - 輸出 / 通道： | 130mA |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 32-QFN 裸露焊盤（5x6） |
| 包裝： | 帶卷 (TR) |
10
FN7456.3
September 30, 2011
HIZ State
An internal pull-down resistor connected to the HIZ pin
ensures the device will be active with no connection to the
HIZ pin. The HIZ state is established within approximately
15ns (Figure 16) by placing a logic high (>2V) on the HIZ
pin. If the HIZ state is selected, the output is a high
impedance 1.4M
Ω with approximately 1.5pF in parallel with
a 10
A bias current from the output. Use this state to control
the logic when more than one mux shares a common output.
In the HIZ state the output is three-stated, and maintains its
high Z even in the presence of high slew rates. The supply
current during this state is basically the same as the active
state.
ENABLE and Power Down States
The enable pin is active low. An internal pull-down resistor
ensures the device will be active with no connection to the
ENABLE pin. The Power Down state is established within
approximately 100ns (Figure 14), if a logic high (>2V) is
placed on the ENABLE pin. In the Power Down state, the
output has no leakage but has a large variable capacitance
(on the order of 15pF), and is capable of being back-driven.
Under this condition, large incoming slew rates can cause
fault currents of tens of mA. Do not use this state as a
logic control for applications driving more than one mux
on a common output.
LE State
The ISL59424 is equipped with a Latch Enable pin. A logic
high (>2V) on the LE pin latches the last logic state. This
logic state is preserved when cycling HIZ or ENABLE
functions.
Limiting the Output Current
No output short circuit current limit exists on these parts. All
applications need to limit the output current to less than
50mA. Adequate thermal heat sinking of the parts is also
required.
Application Example
Figure 19 illustrates the use of the ISL59445, two ISL84517
SPST switches and one NC7ST00P5X NAND gate to mux 3
different component video signals and one RGB video
signal. The SPDT switches provide the sync signal for the
RGB video and disconnects the sync signal for the
component signal.
PC Board Layout
The frequency response of this circuit depends greatly on
the care taken in designing the PC board. The following are
recommendations to achieve optimum high frequency
performance from your PC board.
The use of low inductance components such as chip
resistors and chip capacitors is strongly recommended.
Minimize signal trace lengths. Trace inductance and
capacitance can easily limit circuit performance. Avoid
sharp corners, use rounded corners when possible. Vias
in the signal lines add inductance at high frequency and
should be avoided. PCB traces greater than 1" begin to
exhibit transmission line characteristics with signal rise/fall
times of 1ns or less. High frequency performance may be
degraded for traces greater than one inch, unless strip line
are used.
Match channel-to-channel analog I/O trace lengths and
layout symmetry. This will minimize propagation delay
mismatches.
Maximize use of AC de-coupled PCB layers. All signal I/O
lines should be routed over continuous ground planes (i.e.
no split planes or PCB gaps under these lines). Avoid vias
in the signal I/O lines.
Use proper value and location of termination resistors.
Termination resistors should be as close to the device as
possible.
When testing use good quality connectors and cables,
matching cable types and keeping cable lengths to a
minimum.
Minimum of 2 power supply de-coupling capacitors are
recommended (1000pF, 0.01F) as close to the devices
as possible - Avoid vias between the capacitor and the
device because vias add unwanted inductance. Larger
caps can be farther away. When vias are required in a
layout, they should be routed as far away from the device
as possible.
V+
V-
V+
V-
V+
V-
LOGIC
CONTROL
GND
IN0
IN1
S0
OUT
EXTERNAL
CIRCUITS
SCHOTTKY
PROTECTION
V+
V-
POWER
GND
SIGNAL
LOGIC
V+ SUPPLY
V- SUPPLY
DE-COUPLING
CAPS
FIGURE 19. SCHOTTKY PROTECTION CIRCUIT
ISL59424, ISL59445
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 3-1877847-7 | PLUG 7POS 0 DEG BLK/YEL 5.3-6.5 |
| VI-BN1-MU-F2 | CONVERTER MOD DC/DC 12V 200W |
| 3-1877847-1 | PLUG 7POS 0 DEG GRY/WH 5.3-6.5 |
| VI-BN1-MU-F1 | CONVERTER MOD DC/DC 12V 200W |
| VE-B6X-MX-S | CONVERTER MOD DC/DC 5.2V 75W |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL59446 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:500MHz Triple 4:1 Gain-of-2, Multiplexing Amplifier |
| ISL59446IRZ | 功能描述:IC AMP MUX 4:1 500MHZ 32-QFN RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 視頻放大器和頻緩沖器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 應(yīng)用:TFT-LCD 面板：VCOM 驅(qū)動器 輸出類型:滿擺幅 電路數(shù):1 -3db帶寬:35MHz 轉(zhuǎn)換速率:40 V/µs 電流 - 電源:3.7mA 電流 - 輸出 / 通道:1.3A 電壓 - 電源，單路/雙路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬）裸露焊盤 供應(yīng)商設(shè)備封裝:8-uMax-EP 包裝:管件 |
| ISL59446IRZ-EVAL | 功能描述:EVAL BOARD FOR ISL59446 RoHS:否 類別:編程器，開發(fā)系統(tǒng) >> 評估演示板和套件 系列:* 標(biāo)準(zhǔn)包裝:1 系列:PSoC® 主要目的:電源管理，熱管理 嵌入式:- 已用 IC / 零件:- 主要屬性:- 次要屬性:- 已供物品:板，CD，電源 |
| ISL59446IRZ-T7 | 功能描述:IC AMP MUX 4:1 500MHZ 32-QFN RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 視頻放大器和頻緩沖器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 應(yīng)用:TFT-LCD 面板：VCOM 驅(qū)動器 輸出類型:滿擺幅 電路數(shù):1 -3db帶寬:35MHz 轉(zhuǎn)換速率:40 V/µs 電流 - 電源:3.7mA 電流 - 輸出 / 通道:1.3A 電壓 - 電源，單路/雙路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬）裸露焊盤 供應(yīng)商設(shè)備封裝:8-uMax-EP 包裝:管件 |
| ISL59448 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:500MHz Triple 2:1 Gain-of-2, Multiplexing Amplifier |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。