參數(shù)資料
型號(hào): ISL5757IAZ
廠商: Intersil
文件頁數(shù): 1/13頁
文件大?。?/td> 0K
描述: IC DAC 10-BIT 260MSPS 28-TSSOP
標(biāo)準(zhǔn)包裝: 50
位數(shù): 10
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 1
電壓電源: 模擬和數(shù)字
功率耗散(最大): 157mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 28-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 28-TSSOP
包裝: 管件
輸出數(shù)目和類型: 4 電流,單極
采樣率(每秒): 260M
1
FN6078.1
ISL5757
10-bit, +3.3V, 260+MSPS, High Speed D/A
Converter
The ISL5757 is a 10-bit, 260+MSPS (Mega Samples Per
Second), CMOS, high speed, low power, D/A (digital to
analog) converter, designed specifically for use in high
performance communication systems such as base
transceiver stations utilizing 2.5G or 3G cellular protocols.
This device complements the ISL5x57 family of high speed
converters, which include 10, 12, and 14-bit devices.
Features
Low Power . . . . . 103mW with 20mA Output at 130MSPS
Adjustable Full Scale Output Current. . . . . 2mA to 20mA
+3.3V Power Supply
3V LVCMOS Compatible Inputs
Excellent Spurious Free Dynamic Range
(71dBc to Nyquist, fS = 130MSPS, fOUT = 10MHz)
UMTS Adjacent Channel Power = 65dB at 19.2MHz
EDGE/GSM SFDR = 83dBc at 11MHz in 20MHz Window
Pin compatible, 3.3V, Lower Power Replacement For The
AD9750 and HI5760
Pb-Free Available (RoHS Compliant)
Applications
Cellular Infrastructure - Single or Multi-Carrier: IS-136,
IS-95, GSM, EDGE, CDMA2000, WCDMA, TDS-CDMA
BWA Infrastructure
Medical/Test Instrumentation
Wireless Communication Systems
High Resolution Imaging Systems
Arbitrary Waveform Generators
Pinout
ISL5757
TOP VIEW
Ordering Information
PART
NUMBER
TEMP.
RANGE
(°C)
PACKAGE
PKG.
DWG. #
CLOCK
SPEED
ISL5757IB
-40 to 85 28 Ld SOIC
M28.3
260MHz
ISL5757IBZ
(See Note)
-40 to 85 28 Ld SOIC
(Pb-free)
M28.3
260MHz
ISL5757IA
-40 to 85 28 Ld TSSOP
M28.173 260MHz
ISL5757IAZ
(See Note)
-40 to 85 28 Ld TSSOP
(Pb-free)
M28.173 260MHz
ISL5757EVAL1
25
SOIC Evaluation Platform 260MHz
NOTE: Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with
both SnPb and Pb-free soldering operations. Intersil Pb-free products
are MSL classified at Pb-free peak reflow temperatures that meet or
exceed the Pb-free requirements of IPC/JEDEC J STD-020C.
28
27
26
25
24
23
22
21
20
19
18
17
16
15
D9 (MSB)
D8
D7
D6
D5
D4
D3
D2
D1
D0 (LSB)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CLK
DCOM
NC
AVDD
COMP
IOUTB
NC
FSADJ
REFIO
REFLO
SLEEP
DVDD
IOUTA
ACOM
DCOM
Data Sheet
November 12, 2004
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
相關(guān)PDF資料
PDF描述
LT6552IDD IC OPAMP VID DIFF SGL 3.3V 8-DFN
ISL5861IBZ CONV D/A 12-BIT HS 28-SOIC
VE-J4W-MW-S CONVERTER MOD DC/DC 5.5V 100W
VI-J0R-MZ-B1 CONVERTER MOD DC/DC 7.5V 25W
LT1190CS8#TR IC AMP VIDEO SGL HI SPEED 8SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISL5757IB 功能描述:IC DAC 10BIT 260MHZ 28-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散(最大):- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率(每秒):*
ISL5757IBZ 功能描述:IC DAC 10BIT 260MHZ 28-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1,000 系列:- 設(shè)置時(shí)間:1µs 位數(shù):8 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:8 電壓電源:雙 ± 功率耗散(最大):941mW 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:24-SOIC(0.295",7.50mm 寬) 供應(yīng)商設(shè)備封裝:24-SOIC W 包裝:帶卷 (TR) 輸出數(shù)目和類型:8 電壓,單極 采樣率(每秒):*
ISL5761 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:10-bit, +3.3V, 130/210MSPS, CommLink TM High Speed D/A Converter
ISL5761/21A 制造商:Rochester Electronics LLC 功能描述:- Bulk
ISL5761/2IA 功能描述:IC DAC 10BIT 130MSPS 28-TSSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散(最大):- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率(每秒):*