參數(shù)資料
型號(hào): ISL32374EFVZ-T
廠商: Intersil
文件頁(yè)數(shù): 10/20頁(yè)
文件大?。?/td> 0K
描述: IC XMITTER ESD RS422 LP 16-TSSOP
標(biāo)準(zhǔn)包裝: 2,500
類(lèi)型: 發(fā)射器
驅(qū)動(dòng)器/接收器數(shù): 4/0
規(guī)程: RS422
電源電壓: 3 V ~ 5.5 V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 16-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 16-TSSOP
包裝: 帶卷 (TR)
18
FN6824.1
March 13, 2013
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N16
16
7
α
-
Rev. 1 6/05
相關(guān)PDF資料
PDF描述
VI-2W3-MX-F1 CONVERTER MOD DC/DC 24V 75W
MAX1279BETC+ IC ADC 12BIT 1.5MSPS 12-TQFN
VI-24B-CU-B1 CONVERTER MOD DC/DC 95V 200W
VI-2W2-MX-F4 CONVERTER MOD DC/DC 15V 75W
ISL32374EFBZ-T IC XMITTER ESD RS422 LP 16-SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISL32374EIBZ 功能描述:IC XMITTER ESD RS422 LP 16-SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器,接收器,收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 類(lèi)型:發(fā)射器 驅(qū)動(dòng)器/接收器數(shù):4/0 規(guī)程:RS422,RS485 電源電壓:4.75 V ~ 5.25 V 安裝類(lèi)型:表面貼裝 封裝/外殼:16-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR)
ISL32374EIBZ-T 功能描述:IC XMITTER ESD RS422 LP 16-SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器,接收器,收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 類(lèi)型:發(fā)射器 驅(qū)動(dòng)器/接收器數(shù):4/0 規(guī)程:RS422,RS485 電源電壓:4.75 V ~ 5.25 V 安裝類(lèi)型:表面貼裝 封裝/外殼:16-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR)
ISL32374EIVZ 功能描述:IC XMITTER ESD RS422 LP 16-TSSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器,接收器,收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 類(lèi)型:發(fā)射器 驅(qū)動(dòng)器/接收器數(shù):4/0 規(guī)程:RS422,RS485 電源電壓:4.75 V ~ 5.25 V 安裝類(lèi)型:表面貼裝 封裝/外殼:16-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR)
ISL32374EIVZ-T 功能描述:IC XMITTER ESD RS422 LP 16-TSSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器,接收器,收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 類(lèi)型:發(fā)射器 驅(qū)動(dòng)器/接收器數(shù):4/0 規(guī)程:RS422,RS485 電源電壓:4.75 V ~ 5.25 V 安裝類(lèi)型:表面貼裝 封裝/外殼:16-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR)
ISL3241E 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:QFN Packaged, ±15kV ESD Protected, +2.7V to +3.6V, 250kbps, RS-232 Transmitters/Receivers with Separate Logic Supply Pin