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參數(shù)資料
| 型號： | ISL32273EIVZ |
| 廠商： | Intersil |
| 文件頁數(shù)： | 13/22頁 |
| 文件大小： | 0K |
| 描述： | IC RCVR RS485/422 QD ESD 16TSSOP |
| 產(chǎn)品培訓(xùn)模塊： | Solutions for Industrial Control Applications |
| 標(biāo)準(zhǔn)包裝： | 960 |
| 類型： | 接收器 |
| 驅(qū)動(dòng)器/接收器數(shù)： | 0/4 |
| 規(guī)程： | RS422，RS485 |
| 電源電壓： | 3 V ~ 5.5 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-TSSOP |
| 包裝： | 管件 |
20
FN7529.1
March 14, 2013
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3859
0.3937
9.80
10.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N16
16
7
α
0°
8°
0°
8°
-
Rev. 1 6/05
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| ISL32273EIVZ-T | 功能描述:IC RCVR RS485/422 QD ESD 16TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 類型:發(fā)射器 驅(qū)動(dòng)器/接收器數(shù):4/0 規(guī)程:RS422，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
| ISL32274E | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:QUAD, ±16.5kV ESD Protected, 3.0V to 5.5V, Low Power, RS-422 Transmitters |
| ISL32274EFBZ | 功能描述:IC XMITTER ESD RS422 LP 16-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 類型:發(fā)射器 驅(qū)動(dòng)器/接收器數(shù):4/0 規(guī)程:RS422，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
| ISL32274EFBZ-T | 功能描述:IC XMITTER ESD RS422 LP 16-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 類型:發(fā)射器 驅(qū)動(dòng)器/接收器數(shù):4/0 規(guī)程:RS422，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
| ISL32274EFVZ | 功能描述:IC XMITTER ESD RS422 LP 16-TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:- 類型:發(fā)射器 驅(qū)動(dòng)器/接收器數(shù):4/0 規(guī)程:RS422，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
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