Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certificati" />
參數資料
型號: ISL32177EIRZ
廠商: Intersil
文件頁數: 15/22頁
文件大?。?/td> 0K
描述: IC RCVR RS485/422 QD ESD 24QFN
標準包裝: 75
類型: 接收器
驅動器/接收器數: 0/4
規(guī)程: RS422,RS485
電源電壓: 3 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 24-VFQFN 裸露焊盤
供應商設備封裝: 24-QFN 裸露焊盤(4x4)
包裝: 管件
22
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7529.1
March 14, 2013
For additional products, see www.intersil.com/product_tree
ISL32173E, ISL32175E, ISL32177E, ISL32273E, ISL32275E, ISL32277E
Thin Shrink Small Outline Package Family (TSSOP)
N
(N/2)+1
(N/2)
TOP VIEW
A
D
0.20 C
2X
B A
N/2 LEAD TIPS
B
E1
E
0.25
CAB
M
1
H
PIN #1 I.D.
0.05
e
C
0.10 C
N LEADS
SIDE VIEW
0.10
CAB
M
b
c
SEE DETAIL “X”
END VIEW
DETAIL X
A2
0° - 8°
GAUGE
PLANE
0.25
L
A1
A
L1
SEATING
PLANE
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
SYMBOL
MILLIMETERS
TOLERANCE
14 LD 16 LD 20 LD 24 LD 28 LD
A
1.20
Max
A1
0.10
±0.05
A2
0.90
±0.05
b
0.25
+0.05/-0.06
c
0.15
+0.05/-0.06
D
5.00
6.50
7.80
9.70
±0.10
E
6.40
Basic
E1
4.40
±0.10
e
0.65
Basic
L
0.60
±0.15
L1
1.00
Reference
Rev. F 2/07
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
相關PDF資料
PDF描述
MAX140CMH+D IC ADC 3.5 DIG W/LED DVR 44MQFP
VE-2WH-MX-F4 CONVERTER MOD DC/DC 52V 75W
D38999/24JD19PA CONN RCPT 19POS JAM NUT W/PINS
MAX160CWN+T IC ADC 8BIT UP COMPATIBLE 18SOIC
VE-2WH-MX-F3 CONVERTER MOD DC/DC 52V 75W
相關代理商/技術參數
參數描述
ISL32177EIRZ-T 功能描述:IC RCVR RS485/422 QD ESD 24QFN RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器,接收器,收發(fā)器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 類型:發(fā)射器 驅動器/接收器數:4/0 規(guī)程:RS422,RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC(0.154",3.90mm 寬) 供應商設備封裝:16-SOIC 包裝:帶卷 (TR)
ISL32179E 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:QUAD, ±16.5kV ESD Protected, 3.0V to 5.5V, Low Power, RS-422 Transmitters
ISL32179EFRZ 功能描述:IC XMITTER ESD RS422 LP 24-QFN RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器,接收器,收發(fā)器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 類型:發(fā)射器 驅動器/接收器數:4/0 規(guī)程:RS422,RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC(0.154",3.90mm 寬) 供應商設備封裝:16-SOIC 包裝:帶卷 (TR)
ISL32179EFRZ-T 功能描述:IC XMITTER ESD RS422 LP 24-QFN RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器,接收器,收發(fā)器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 類型:發(fā)射器 驅動器/接收器數:4/0 規(guī)程:RS422,RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC(0.154",3.90mm 寬) 供應商設備封裝:16-SOIC 包裝:帶卷 (TR)
ISL32179EIRZ 功能描述:IC XMITTER ESD RS422 LP 24-QFN RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器,接收器,收發(fā)器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 類型:發(fā)射器 驅動器/接收器數:4/0 規(guī)程:RS422,RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC(0.154",3.90mm 寬) 供應商設備封裝:16-SOIC 包裝:帶卷 (TR)