5
FN6307.5
June 8, 2012
Absolute Maximum Ratings
Thermal Information
VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
DE, RE (Note
20) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input/Output Voltages
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Thermal Resistance (Typical, Note
4)θJA (°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
105
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .
140
10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . .
190
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
128
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
4.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications
Test Conditions: VCC = 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C,
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
TYP
MAX
DC CHARACTERISTICS
Driver Differential VOUT
VOD
RL = 100Ω (RS-422) (Figure 1A, Note 16) Full
2
2.3
-
V
RL = 54Ω (RS-485) (Figure 1A) Full
1.5
2
VCC
V
No Load
-
VCC
RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full
1.5
2.2
-
V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
ΔVOD
RL = 54Ω or 100Ω (Figure 1A) Full
-
0.01
0.2
V
Driver Common-Mode VOUT
VOC
RL = 54Ω or 100Ω (Figure 1A) Full
-
2
3
V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔVOC
RL = 54Ω or 100Ω (Figure 1A) Full
-
0.01
0.2
V
Logic Input High Voltage
VIH
DI, DE, RE
Full
2
-
V
Logic Input Low Voltage
VIL
DI, DE, RE
Full
-
0.8
V
Logic Input Hysteresis
VHYS
25
-
100
-
mV
Logic Input Current
IIN1
DI = DE = RE = 0V or VCC (Note 18) Full
-2
-
2
μA
Input Current (A, B, A/Y, B/Z)
IIN2
DE = 0V, VCC = 0V or
3.6V
VIN = 12V
Full
-
80
125
μA
VIN = -7V
Full
-100
-50
-
μA
Output Leakage Current (Y, Z) (Full
Duplex Versions Only, Note
13)IIN3
RE = 0V, DE = 0V,
VCC = 0V or 3.6V
VIN = 12V
Full
-
10
40
μA
VIN = -7V
Full
-40
-10
-
μA
Output Leakage Current (Y, Z)
in Shutdown Mode (Full Duplex,
IIN4
RE = VCC, DE = 0V,
VCC = 0V or 3.6V
VIN = 12V
Full
-
10
40
μA
VIN = -7V
Full
-40
-10
-
μA
Driver Short-Circuit Current,
VO = High or Low
IOSD1
DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 7) Full
-
±250
mA
Receiver Differential Threshold
Voltage
VTH
-7V
≤ VCM ≤ 12V
Full
-200
-125
-50
mV
Receiver Input Hysteresis
ΔVTH
VCM = 0V
25
-
15
-
mV
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E,ISL3176E, ISL3177E, ISL3178E