23 FN7638.2 Thin Dual Flat No-Lead Plastic Package (TDFN) C // L C e TERMINAL TIP FOR EVEN TERMINAL/" />
參數(shù)資料
型號: ISL31485EIBZ-T7A
廠商: Intersil
文件頁數(shù): 16/24頁
文件大?。?/td> 0K
描述: IC TXRX RS485 FAULT PROT 8SOIC
標(biāo)準(zhǔn)包裝: 1
類型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 1/1
規(guī)程: RS422,RS485
電源電壓: 4.5 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOICN
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: ISL31485EIBZ-T7ADKR
ISL31480E, ISL31483E, ISL31485E, ISL31486E
23
FN7638.2
Thin Dual Flat No-Lead Plastic Package (TDFN)
C
//
L
C
e
TERMINAL TIP
FOR EVEN TERMINAL/SIDE
NX (b)
SECTION "C-C"
5
(A1)
BOTTOM VIEW
A
6
AREA
INDEX
C
0.10
0.08
SIDE VIEW
0.15
2X
E
A
B
C
0.15
D
TOP VIEW
CB
2X
6
8
AREA
INDEX
NX L
E2
E2/2
REF.
e
N
(Nd-1)Xe
(DATUM A)
(DATUM B)
5
0.10
8
7
D2
B
A
M C
N-1
12
PLANE
SEATING
C
A
A3
NX b
D2/2
NX k
L
L12.4x3A
12 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-229-WGED-4 ISSUE C)
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.70
0.75
0.80
-
A1
-
0.05
-
A3
0.20 REF
-
b
0.18
0.23
0.30
5,8
D
4.00 BSC
-
D2
3.15
3.30
3.40
7,8
E
3.00 BSC
-
E2
1.55
1.70
1.80
7,8
e
0.50 BSC
-
k0.20
-
L
0.30
0.40
0.50
8
N12
2
Nd
6
3
Rev. 0 1/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd refers to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
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