2 FN6800.8 November 15, 2012 Ordering Information PART NUMBER (Note 4) PART MARKING PACKAGE (Pb-Free) PKG. DWG. # " />
參數(shù)資料
型號: ISL28414TSSOPEVAL1Z
廠商: Intersil
文件頁數(shù): 12/23頁
文件大?。?/td> 0K
描述: EVALUATION BOARD FOR ISL28414
標準包裝: 1
每 IC 通道數(shù): 4 - 四
放大器類型: 通用
輸出類型: 滿擺幅
轉換速率: 2.5 V/µs
電流 - 輸出 / 通道: 31mA
工作溫度: -40°C ~ 125°C
電流供應(主 IC): 300µA
電壓 - 電源,單路/雙路(±): 1.8 V ~ 5.5 V,±0.9 V ~ 2.5 V
板類型: 完全填充
已供物品:
已用 IC / 零件: ISL28414
ISL28114, ISL28214, ISL28414
2
FN6800.8
November 15, 2012
Ordering Information
PART NUMBER
(Note 4)
PART
MARKING
PACKAGE
(Pb-Free)
PKG.
DWG. #
ISL28114FEZ-T7 (Notes 1, 2)
BKA (Note 5)
5 Ld SC-70
P5.049
ISL28114FEZ-T7A (Notes 1, 2)
BKA (Note 5)
5 Ld SC-70
P5.049
ISL28114FHZ-T7 (Notes 1, 2)
BDBA (Note 5)
5 Ld SOT-23
P5.064A
ISL28114FHZ-T7A (Notes 1, 2)
BDBA (Note 5)
5 Ld SOT-23
P5.064A
ISL28214FUZ (Note 2)
8214Z
8 Ld MSOP
M8.118A
ISL28214FUZ-T7 (Notes 1, 2)
8214Z
8 Ld MSOP
M8.118A
ISL28214FBZ (Note 2)
28214 FBZ
8 Ld SOIC
M8.15E
ISL28214FBZ-T7 (Notes 1, 2)
28214 FBZ
8 Ld SOIC
M8.15E
ISL28214FBZ-T13 (Notes 1, 2)
28214 FBZ
8 Ld SOIC
M8.15E
ISL28214FHZ-T7 (Notes 1, 3)
BELA (Note 5)
8 Ld SOT-23
P8.064
ISL28214FHZ-T7A (Notes 1, 3)
BELA (Note 5)
8 Ld SOT-23
P8.064
ISL28414FVZ (Note 2)
28414 FVZ
14 Ld TSSOP
MDP0044
ISL28414FVZ-T7 (Notes 1, 2)
28414 FVZ
14 Ld TSSOP
MDP0044
ISL28414FVZ-T13 (Notes 1, 2)
28414 FVZ
14 Ld TSSOP
MDP0044
ISL28414FBZ (Note 2)
28414 FBZ
14 Ld SOIC
MDP0027
ISL28414FBZ-T7 (Notes 1, 2)
28414 FBZ
14 Ld SOIC
MDP0027
ISL28414FBZ-T13 (Notes 1, 2)
28414 FBZ
14 Ld SOIC
MDP0027
ISL28114SOT23EVAL1Z
Evaluation Board
ISL28214MSOPEVAL2Z
Evaluation Board
ISL28214SOICEVAL2Z
Evaluation Board
ISL28414TSSOPEVAL1Z
Evaluation Board
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate-e4
termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), please see device information page for ISL28114, ISL28214, ISL28414. For more information on MSL please
see Tech Brief TB363.
5. The part marking is located on the bottom of the part.
Pin Configurations
ISL28114FEZ
(5 LD SC-70)
TOP VIEW
ISL28114
(5 LD SOT-23)
TOP VIEW
ISL28214
(8 LD MSOP, 8 LD SOIC, 8 LD SOT-23)
TOP VIEW
IN+
VS-
IN-
VS+
OUT
1
2
3
5
4
OUT
VS-
IN+
VS+
IN-
1
2
3
5
4
OUT_A
IN-_A
IN+_A
VS-
VS+
OUT_B
IN-_B
IN+_B
1
2
3
45
6
7
8
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ISL28417FBBZ 功能描述:IC INTERFACE RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:* 標準包裝:75 系列:MicroAmplifier™ 放大器類型:通用 電路數(shù):1 輸出類型:滿擺幅 轉換速率:0.03 V/µs 增益帶寬積:100kHz -3db帶寬:- 電流 - 輸入偏壓:1pA 電壓 - 輸入偏移:60µV 電流 - 電源:20µA 電流 - 輸出 / 通道:5mA 電壓 - 電源,單路/雙路(±):2.3 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應商設備封裝:8-SOIC 包裝:管件
ISL28417FBBZ-T13 功能描述:IC INTERFACE RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:* 標準包裝:75 系列:MicroAmplifier™ 放大器類型:通用 電路數(shù):1 輸出類型:滿擺幅 轉換速率:0.03 V/µs 增益帶寬積:100kHz -3db帶寬:- 電流 - 輸入偏壓:1pA 電壓 - 輸入偏移:60µV 電流 - 電源:20µA 電流 - 輸出 / 通道:5mA 電壓 - 電源,單路/雙路(±):2.3 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應商設備封裝:8-SOIC 包裝:管件
ISL28417FBBZ-T7 功能描述:IC INTERFACE RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:* 標準包裝:75 系列:MicroAmplifier™ 放大器類型:通用 電路數(shù):1 輸出類型:滿擺幅 轉換速率:0.03 V/µs 增益帶寬積:100kHz -3db帶寬:- 電流 - 輸入偏壓:1pA 電壓 - 輸入偏移:60µV 電流 - 電源:20µA 電流 - 輸出 / 通道:5mA 電壓 - 電源,單路/雙路(±):2.3 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應商設備封裝:8-SOIC 包裝:管件
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