ISL28127, ISL28227
23
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6633.6
December 16, 2010
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to
www.intersil.com/products for a
complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page
FN6633.1
mode voltage sensitivity vs temperature or VOS as a function of supply voltage and temperature:
“The input common mode voltage sensitivity to temperature is shown in Figure 3 (±15V). Figure 20 shows VOS as a function
of supply voltage and temperature with the common mode voltage at 0V for split supply operation.”
9/2/09
7/21/09 Updated Features to show only key features and updated applications section. Added Typical Application Circuit and
performance graph, Updated Ordering Information to match Intrepid and added POD's L8.3x3A and M8.118, also added
MSL level as part of new format. Added TDFN pinouts, updated pin descriptions to include TDFN pinouts, Added Theta Ja in
Thermal information for TDFN and MSOP packages. Added Revision History and Products Text with device info links. Added
SPICE Model with referencing text and Net List.
FN6633.0
5/28/09 Techdocs Issued File Number FN6633. Initial release of Datasheet with file number FN6633 making this a Rev 0.
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make
sure you have the latest Rev. (Continued)
REVISION
DATE
CHANGE