ISL28117, ISL28217, ISL28417
28
November 30, 2012
FN6632.10
August 31, 2010
FN6632.5
1. General changes:
a. Added in Quad devices to the datasheet for SOIC, TSSOP and QFN packages.
b. Added in TDFN packages for single and dual devices.
c. Added in new VOS and TCVOS limits for TDFN packages
d. Added Tja and Tjc Notes for TDFN Package which are “direct attach (Tja) ” and “bottom (Tjc)”
2. Specific changes:
a. Added in ISL28417 to title and front page info on
page 1b. Added in ISL28117FRTZ, ISL28117FRTBZ, ISL28217FRTZ, ISL28217FRTBZ, ISL28417FBZ, ISL28417FVZ,
and ISL28417FRZ packages to Ordering information on
page 2 and
page 2. Added in -T7 and -T7A tape and reel
extensions where applicable.
c. Added in TDFN, 14 Ld SOIC, 14 Ld TSSOP and 16 Ld QFN to pin configurations on
page 3 and
page 3.d. Updated Pin Descriptions tables with new added in packages on
page 4.e. Abs Max Table added in thermal packaging info for TDFN packages on
page 6.f. Electrical Specifications Table - Added two new line items for VOS spec. TDFN package ISL28217 Grade B
limits ±70uV 25C and ±140uV full temp. TDFN package ISL28x17 Grade C limits ±150uV 25C and ±250uV full
g. Electrical Specifications Table - Added two new line items for TCVOS spec. TDFN package ISL28217 Grade B
limits ±0.7uV/C full temp. TDFN package ISL28x17 Grade C limits ±1uV/C on
page 7 and
page 9.h. Added in PODs for L8.3x3A, M14.15, M14.173, and L16.4x4
March 18, 2010
FN6632.4
1. Updated “Ordering Information” on
page 2 by adding two rows for MSOP packages ISL28117FUBZ and
ISL28117FUZ, which are scheduled to release Q2 2010. Added Pinout accordingly.
2. Added POD for MSOP M8.118 to the end of datasheet
3. In “Ordering Information” on
page 2, Separated each part number with it's own specific -T7 and -T13 suffix
and removed “Add “-T7” or “-T13” suffix for Tape and Reel.” from Note
1.4. Updated ±15 and ±5V Electrical Specification table with the following edits:
A) Separated VOS specs for SOIC and MSOP Grade C packages. Added new VOS specs for MSOP Grade C
package.
B) Separated TCVOS specs for SOIC and MSOP Grade C packages. Added new TCVOS specs for MSOP Grade C
package.
March 3, 2010
Added Evaluation Boards to “Ordering Information” on
page 2.Updated Theta JA for ISL28217 8 Ld SOIC from 115°C/W to 105°C/W.
January 21, 2010
Part marking in “Ordering Information” on
page 2 changed as follows:
ISL28117FBBZ changed from "28117 FBZ -B" to "28117 FBZ"
ISL28117FBZ changed from "28117 FBZ" to "28117 FBZ -C"
ISL28217FBBZ changed from "28217 FBZ -B" to "28217 FBZ"
ISL28217FBZ changed from "28217 FBZ" to "28217 FBZ -C"
December 24, 2009
On page 10: Changed label in Figure 3 from “VS = +5V” to “VS = ±5V” On page 10: Changed label in Figure 4 from “VS = +15V” to “VS = ±15V” November 25, 2009
Changed Typical VOS spec from “13” to “8” (B Grade), “19” to “4” (C Grade), IB from “0.18” to “0.08, IOS from
“0.3” to “0.08”. Edited Spice Schematic - L1 from “95.4957” to “15.9159E”, R1 from “6k” to 1, R9 from “1” to
“2.1E3”, R10 from “1” to “2.1E3, R12 from “6k” to “1”, L2 from “95.4957” to “15.9159E”. Edited Spice Net List
- Changed Revision from “A” to “B”, Date change from “October 29th 2009” to “November 20th 2009”, added
after AOL “SR = 0.5V/sec, Input Stage changed in I_IOS from “0.3E-9” to 0.08E-9”, V_VOS “13e-6” to
“8e-6”, Mid supply Ref R_R9 and R_R10 changed “1” to “2.1E3”, Common Mode Gain Stage with Zero change
in G_G5 and G_G6 “5.27046e-15” to “3.162277”, R_R11 and R_R12 “6.3” to “1”, L_L1 and L_L2 “95.4957” to
“15.9159E-3”
November 12, 2009
FN6632.3
Updated Typical Performance Curves Figure 5, 7, 9, 11, 13, 15, 17 and 19. Added Spice Model and license
statement. Replaced typical application schematic.
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make
sure you have the latest Rev. (Continued)
DATE
REVISION
CHANGE