22 FN6800.8 November 15, 2012 Thin Shrink Small Outline Package Family (TSSOP) N (N/2)+1 (N/2) TOP VIEW A D" />
參數(shù)資料
型號(hào): ISL28114FEZ-T7A
廠商: Intersil
文件頁(yè)數(shù): 15/23頁(yè)
文件大小: 0K
描述: IC OPAMP GP RRIO 5MHZ SC70-5
標(biāo)準(zhǔn)包裝: 250
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 2.5 V/µs
增益帶寬積: 5MHz
電流 - 輸入偏壓: 3pA
電壓 - 輸入偏移: 500µV
電流 - 電源: 300µA
電流 - 輸出 / 通道: 31mA
電壓 - 電源,單路/雙路(±): 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-TSSOP(5 引線),SC-88A,SOT-353
供應(yīng)商設(shè)備封裝: SC-70-5
包裝: 帶卷 (TR)
ISL28114, ISL28214, ISL28414
22
FN6800.8
November 15, 2012
Thin Shrink Small Outline Package Family (TSSOP)
N
(N/2)+1
(N/2)
TOP VIEW
A
D
0.20 C
2X
B A
N/2 LEAD TIPS
B
E1
E
0.25
CAB
M
1
H
PIN #1 I.D.
0.05
e
C
0.10 C
N LEADS
SIDE VIEW
0.10
CAB
M
b
c
SEE DETAIL “X”
END VIEW
DETAIL X
A2
0° - 8°
GAUGE
PLANE
0.25
L
A1
A
L1
SEATING
PLANE
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
SYMBOL
MILLIMETERS
TOLER-
ANCE
14 LD
16 LD
20 LD
24 LD
28 LD
A
1.20
Max
A1
0.10
±0.05
A2
0.90
±0.05
b
0.25
+0.05/-0.06
c
0.15
+0.05/-0.06
D
5.00
6.50
7.80
9.70
±0.10
E
6.40
Basic
E1
4.40
±0.10
e
0.65
Basic
L
0.60
±0.15
L1
1.00
Reference
Rev. F 2/07
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15mm per
side.
2. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm per side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
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