22 FN6728.7 November 15, 2012 Thin Shrink Small Outline Package Family (TSSOP) N (N/2)+1 (N/2) TOP VIEW A D" />
參數(shù)資料
型號(hào): ISL28113SOT23EVAL1Z
廠商: Intersil
文件頁(yè)數(shù): 15/23頁(yè)
文件大小: 0K
描述: EVALUATION BOARD FOR ISL28113
標(biāo)準(zhǔn)包裝: 1
每 IC 通道數(shù): 1 - 單
放大器類型: 通用
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 1 V/µs
電流 - 輸出 / 通道: 22mA
工作溫度: -40°C ~ 125°C
電流供應(yīng)(主 IC): 90µA
電壓 - 電源,單路/雙路(±): 2.4 V ~ 5.5 V,±1.2 V ~ 2.75 V
板類型: 完全填充
已供物品:
已用 IC / 零件: ISL28113
ISL28113, ISL28213, ISL28413
22
FN6728.7
November 15, 2012
Thin Shrink Small Outline Package Family (TSSOP)
N
(N/2)+1
(N/2)
TOP VIEW
A
D
0.20 C
2X
B A
N/2 LEAD TIPS
B
E1
E
0.25
CAB
M
1
H
PIN #1 I.D.
0.05
e
C
0.10 C
N LEADS
SIDE VIEW
0.10
CAB
M
b
c
SEE DETAIL “X”
END VIEW
DETAIL X
A2
0° - 8°
GAUGE
PLANE
0.25
L
A1
A
L1
SEATING
PLANE
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
SYMBOL
MILLIMETERS
TOLER-
ANCE
14 LD
16 LD
20 LD
24 LD
28 LD
A
1.20
Max
A1
0.10
±0.05
A2
0.90
±0.05
b
0.25
+0.05/-0.06
c
0.15
+0.05/-0.06
D
5.00
6.50
7.80
9.70
±0.10
E
6.40
Basic
E1
4.40
±0.10
e
0.65
Basic
L
0.60
±0.15
L1
1.00
Reference
Rev. F 2/07
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15mm per
side.
2. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm per side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
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