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參數(shù)資料
| 型號： | ISL24003IRZ-T7 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 10/10頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC BUFFER 18CH VCOM DRVR 44-QFN |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 應(yīng)用： | TFT-LCD 面板：伽瑪緩沖器，VCOM 驅(qū)動器 |
| 輸出類型： | 滿擺幅 |
| 電路數(shù)： | 18 |
| -3db帶寬： | 10MHz |
| 轉(zhuǎn)換速率： | 9 V/µs |
| 電流 - 電源： | 11.5mA |
| 電流 - 輸出 / 通道： | 130mA |
| 電壓 - 電源，單路/雙路(±)： | 4.5 V ~ 16.5 V，±2.25 V ~ 8.25 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 44-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 44-QFN-EP（7x7） |
| 包裝： | 帶卷 (TR) |
9
FN6118.0
December 7, 2005
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended, lead lengths
should be as short as possible, and the power supply pins
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the VS- pin is
connected to ground, one 0.1F ceramic capacitor should be
placed from the VS+ pin to ground. A 4.7F tantalum
capacitor should then be connected from the VS+ pin to
ground. One 4.7F capacitor may be used for multiple
devices. This same capacitor combination should be placed
at each supply pin to ground if split supplies are to be used.
Important Note: The metal plane used for heat sinking of
the device is electrically connected to the negative
supply potential (VS-). If VS- is tied to ground, the
thermal pad can be connected to ground. Otherwise, the
thermal pad must be isolated from any other power
planes.
ISL24003
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