參數(shù)資料
型號: ISL22343TFV20Z
廠商: Intersil
文件頁數(shù): 12/18頁
文件大?。?/td> 0K
描述: IC POT DGTL 256TP LN LP 20-TSSOP
標準包裝: 740
系列: XDCP™
接片: 256
電阻(歐姆): 100k
電路數(shù): 4
溫度系數(shù): 標準值 ±45 ppm/°C
存儲器類型: 非易失
接口: I²C(設備位址)
電源電壓: 2.25 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 20-TSSOP(0.173",4.40mm 寬)
供應商設備封裝: 20-TSSOP
包裝: 管件
3
FN6423.1
March 13, 2008
Pin Descriptions
TSSOP PIN
QFN PIN
SYMBOL
DESCRIPTION
1
19
RH3
“High” terminal of DCP3
2
20
RL3
“Low” terminal of DCP3
3
1
RW3
“Wiper” terminal of DCP3
4
2
A2
Device address input for the I2C interface
5
3
SCL
Open drain I2C interface clock input
6
4
SDA
Open drain Serial data I/O for the I2C interface
7
5
GND
Device ground pin
8
6
RW2
“Wiper” terminal of DCP2
9
7
RL2
“Low” terminal of DCP2
10
8
RH2
“High” terminal of DCP2
11
9
RW1
“Wiper” terminal of DCP1
12
10
RL1
“Low” terminal of DCP1
13
11
RH1
“High” terminal of DCP1
14
12
A0
Device address input for the I2C interface
15
13
A1
Device address input for the I2C interface
16
14
VCC
Positive power supply pin
17
15
V-
Negative power supply pin
18
16
RH0
“High” terminal of DCP0
19
17
RL0
“Low” terminal of DCP0
20
18
RW0
“Wiper” terminal of DCP0
EPAD*
Exposed Die Pad internally connected to V-
NOTE: *PCB thermal land for QFN EPAD should be connected to V- plane or left floating. For more information refer to
http://www.intersil.com/data/tb/TB389.pdf
ISL22343
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