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FN6916.0
September 23, 2009
ISL1539A
HTSSOP (Heat-Sink TSSOP) Family
N
(N/2)+1
(N/2)
TOP VIEW
A
D
0.20 C
2X
B A
N/2 LEAD TIPS
B
E1
E
0.25
CA B
M
1
H
PIN #1 I.D.
0.05
e
C
0.10 C
N LEADS
SIDE VIEW
0.10
CAB
M
b
c
SEE DETAIL
END VIEW
SEATING
PLANE
BOTTOM VIEW
EXPOSED
THERMAL PAD
E2
D1
DETAIL X
A2
0¨¨
GAUGE
PLANE
0.25
L
A1
A
L1
MDP0048
HTSSOP (HEAT-SINK TSSOP) FAMILY
SYMBOL
MILLIMETERS
TOLER-
ANCE
14 LD
20 LD
24 LD
28 LD
38 LD
A
1.20
Max
A1
0.075
±0.075
A2
0.90
+0.15/-0.10
b
0.25
0.22
+0.05/-0.06
c
0.15
+0.05/-0.06
D
5.00
6.50
7.80
9.70
±0.10
D1
3.2
4.2
4.3
5.0
7.25
Reference
E
6.40
Basic
E1
4.40
±0.10
E2
3.0
Reference
e
0.65
0.50
Basic
L
0.60
±0.15
L1
1.00
Reference
N
142024
2838
Reference
Rev. 3 2/07
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15mm per
side.
2. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm per side.
3. Dimensions “D” and “E1” are measured at Datum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.