Publication Release Date: Nov 6, 2008 - 12 - Revision 1.31 7.2 16 SPI O
參數(shù)資料
型號(hào)： ISD1740SYIR
廠商： Nuvoton Technology Corporation of America
文件頁(yè)數(shù)： 4/24頁(yè)
文件大小： 0K
描述： IC VOICE REC/PLAY 40SEC 28-SOIC
標(biāo)準(zhǔn)包裝： 1,000
系列： ISD1700, ChipCorder®
接口： SPI
持續(xù)時(shí)間： 40 秒
安裝類型： 表面貼裝
封裝/外殼： 28-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 28-SOIC
配用： ISD-COB1790-ND - BOARD DEMO FOR ISD1790
ISD-COB1760-ND - BOARD DEMO FOR ISD1760
ISD-COB1750-ND - BOARD DEMO FOR ISD1750
ISD-COB1740-ND - BOARD DEMO FOR ISD1740
ISD-COB1730-ND - BOARD DEMO FOR ISD1730
ISD-COB17240-ND - BOARD DEMO FOR ISD17240
ISD-COB17210-ND - BOARD DEMO FOR ISD17210
ISD-COB17150-ND - BOARD DEMO FOR ISD17150
ISD-ES17XX_USB_PB-ND - BOARD DEMO FOR ISD1700 SERIES
PRELIMINARY ISD1700 SERIES
Publication Release Date: Nov 6, 2008
- 12 -
Revision 1.31
7.2
16
SPI OPERATION
T
SSH
T
SSmin
T
SCKhi
T
SSS
T
DIS
T
DIH
T
SCKlow
T
DF
(TRISTATE)
SS
SCLK
MOSI
MISO
LSB
T
PD
MSB
LSB
MSB
Figure 12.8: SPI Operation
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
SS Setup Time
TSSS
500
nsec
SS Hold Time
TSSH
500
nsec
Data in Setup Time
TDIS
200
nsec
Data in Hold Time
TDIH
200
nsec
Output Delay
TPD
500
nsec
Output Delay to HighZ
TDF
500
nsec
SS HIGH
TSSmin
1
sec
SCLK High Time
TSCKhi
400
nsec
SCLK Low Time
TSCKlow
400
nsec
CLK Frequency
F0
1,000
KHz
Power-Up Delay
[1]
TPUD
50
msec
Notes:
[1] The value shown is based upon 8 kHz sampling frequency. Delay increases proportionally for slower
sampling frequency.
相關(guān)PDF資料
PDF描述
ISD17210SYR IC VOICE REC/PLAY 210SEC 28-SOIC
ISD17210SYIR IC VOICE REC/PLAY 210SEC 28-SOIC
ISD17180SYR IC VOICE REC/PLAY 180SEC 28-SOIC
ISD17180SYIR IC VOICE REC/PLAY 180SEC 28-SOIC
ISD17150SYR IC VOICE REC/PLAY 150SEC 28-SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD1740SYIR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD1740SYR 功能描述:IC VOICE REC/PLAY 40SEC 28-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD1740SYR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD1740XY 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD1740XY01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
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