Publication Release Date: Nov 6, 2008 - 2 - Revision 1.31 TABLE OF CONTENTS 1 GENERAL DESCRIPTION ...." />
參數(shù)資料
型號(hào): ISD17210SYR
廠商: Nuvoton Technology Corporation of America
文件頁(yè)數(shù): 12/24頁(yè)
文件大?。?/td> 0K
描述: IC VOICE REC/PLAY 210SEC 28-SOIC
標(biāo)準(zhǔn)包裝: 1,000
系列: ISD1700, ChipCorder®
接口: SPI
持續(xù)時(shí)間: 210 秒
安裝類型: 表面貼裝
封裝/外殼: 28-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 28-SOIC
配用: ISD-COB1790-ND - BOARD DEMO FOR ISD1790
ISD-COB1760-ND - BOARD DEMO FOR ISD1760
ISD-COB1750-ND - BOARD DEMO FOR ISD1750
ISD-COB1740-ND - BOARD DEMO FOR ISD1740
ISD-COB1730-ND - BOARD DEMO FOR ISD1730
ISD-COB17240-ND - BOARD DEMO FOR ISD17240
ISD-COB17210-ND - BOARD DEMO FOR ISD17210
ISD-COB17150-ND - BOARD DEMO FOR ISD17150
ISD-ES17XX_USB_PB-ND - BOARD DEMO FOR ISD1700 SERIES
PRELIMINARY ISD1700 SERIES
Publication Release Date: Nov 6, 2008
- 2 -
Revision 1.31
TABLE OF CONTENTS
相關(guān)PDF資料
PDF描述
ISD17210SYIR IC VOICE REC/PLAY 210SEC 28-SOIC
ISD17180SYR IC VOICE REC/PLAY 180SEC 28-SOIC
ISD17180SYIR IC VOICE REC/PLAY 180SEC 28-SOIC
ISD17150SYR IC VOICE REC/PLAY 150SEC 28-SOIC
ISD17150SYIR IC VOICE REC/PLAY 150SEC 28-SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17210SYR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XY 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XY01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYI 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYI01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices