Publication Release Date: Nov 6, 2008 - 16 - Revision 1.31 10 9 TYPICAL APPLICATION CIRCUITS The follo" />
參數(shù)資料
型號(hào)： ISD17180EYI
廠商： Nuvoton Technology Corporation of America
文件頁(yè)數(shù)： 8/24頁(yè)
文件大?。?/td> 0K
描述： IC VOICE REC/PLAY 180SEC 28-TSOP
標(biāo)準(zhǔn)包裝： 234
系列： ISD1700, ChipCorder®
接口： SPI
持續(xù)時(shí)間： 180 秒
安裝類(lèi)型： 表面貼裝
封裝/外殼： 28-TSSOP（0.465"，11.8mm 寬）
供應(yīng)商設(shè)備封裝： 28-TSOP
配用： ISD-COB1790-ND - BOARD DEMO FOR ISD1790
ISD-COB1760-ND - BOARD DEMO FOR ISD1760
ISD-COB1750-ND - BOARD DEMO FOR ISD1750
ISD-COB1740-ND - BOARD DEMO FOR ISD1740
ISD-COB1730-ND - BOARD DEMO FOR ISD1730
ISD-COB17240-ND - BOARD DEMO FOR ISD17240
ISD-COB17210-ND - BOARD DEMO FOR ISD17210
ISD-COB17150-ND - BOARD DEMO FOR ISD17150
ISD-ES17XX_USB_PB-ND - BOARD DEMO FOR ISD1700 SERIES
PRELIMINARY ISD1700 SERIES
Publication Release Date: Nov 6, 2008
- 16 -
Revision 1.31
10
9
TYPICAL APPLICATION CIRCUITS
The following typical applications examples on ISD1700 Series are for references only. They make no
representation or warranty that such applications shall be suitable for the use specified. Each design
has to be optimized in its own system for the best performance on voice quality, current consumption,
functionalities and etc.
The below notes apply to the following applications examples:
*
These capacitors may be needed in order to optimize for the best voice quality, which is also dependent
upon the layout of the PCB. Depending on system requirements, they can be 10
μF, 4.7 μF or other values.
Please refer to the applications notes or consult Nuvoton for layout advice.
** It is important to have a separate path for each ground and power back to the related terminals to minimize
the noise. Also, the power supplies should be decoupled as close to the device as possible
.
Example #1: Recording using microphone input via push-button controls
Vcc
ISD1700
R
OSC
V
CCA
SP+
AUD/AUX
ERASE
PLAY
REC
AGC
V
SSD
V
CCD
AnaIn
MIC -
MIC+
MISO
MOSI
SCLK
SS
FWD
VOL
V
CCA
0.1 F
μ
V
CCD
*
24
23
25
26
19
10
11
20
18
1
28
17
22
9
V
CCA
V
CCD
V
CCP
V
SSA
V
CCP
V
SSP1
SP-
V
SSP2
V
CCP
0.1 F
μ
0.1 F
μ
*
21
8
14
16
12
0.1 F
μ
*
INT/RDY
27
7
6
5
4
V
CC
4.7 F
μ
Ω
4.7 K
0.1 F
μ
4.7 K
Ω
0.1 F
μ
4.7 K
Ω
**
*** At 8kHz sampling freq, Rosc = 80 K
Rosc ***
4.7 F
μ
FT
15
13
Speaker
or Buzzer
V
CCD
Optional
Ω
100 K
Optional: based upon the applications
390
Ω
0.1 F
μ
V
CC
8050C
Speaker
AUX
AUD
Gnd
LED
1 K
Ω
D1
2
vAlert
3
RESET
0.1 F
μ
Reset
: Digital ground;
: Analog ground;
: Ground for SP+;
: Ground for SP-
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17180EYI01 功能描述:IC VOICE REC/PLAY 180SEC 28-TSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類(lèi)型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱(chēng):90-21300+000
ISD17180EYIR 功能描述:IC VOICE REC/PLAY 180SEC 28-TSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類(lèi)型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱(chēng):90-21300+000
ISD17180EYIR01 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17180EYR 功能描述:IC VOICE REC/PLAY 180SEC 28-TSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類(lèi)型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱(chēng):90-21300+000
ISD17180EYR01 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
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