Publication Release Date: Nov 6, 2008 - 19 - Revision 1.31 11 10 PACKAGING 11.1 21 28" />
型號:
ISD17150SYR
廠商:
Nuvoton Technology Corporation of America
文件頁數(shù):
11/24頁
文件大?。?/td>
0K
描述:
IC VOICE REC/PLAY 150SEC 28-SOIC
標(biāo)準(zhǔn)包裝:
1,000
系列:
ISD1700, ChipCorder®
接口:
SPI
持續(xù)時間:
150 秒
安裝類型:
表面貼裝
封裝/外殼:
28-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝:
28-SOIC
配用:
ISD-COB1790-ND - BOARD DEMO FOR ISD1790
ISD-COB1760-ND - BOARD DEMO FOR ISD1760
ISD-COB1750-ND - BOARD DEMO FOR ISD1750
ISD-COB1740-ND - BOARD DEMO FOR ISD1740
ISD-COB1730-ND - BOARD DEMO FOR ISD1730
ISD-COB17240-ND - BOARD DEMO FOR ISD17240
ISD-COB17210-ND - BOARD DEMO FOR ISD17210
ISD-COB17150-ND - BOARD DEMO FOR ISD17150
ISD-ES17XX_USB_PB-ND - BOARD DEMO FOR ISD1700 SERIES
ISD17150SYIR
IC VOICE REC/PLAY 150SEC 28-SOIC
VI-23M-IX-F2
CONVERTER MOD DC/DC 10V 75W
VI-23L-IX-F4
CONVERTER MOD DC/DC 28V 75W
VI-23L-IX-F3
CONVERTER MOD DC/DC 28V 75W
VI-23L-IX-F1
CONVERTER MOD DC/DC 28V 75W
ISD17150SYR01
制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17150XY
制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17150XY01
制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17150XYI
制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17150XYI01
制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices