參數(shù)資料
型號: IS93C66A
廠商: Integrated Silicon Solution, Inc.
英文描述: 2K-BIT/4K-BIT SERIAL ELECTRICALLY ERASABLE PROM
中文描述: 2K-BIT/4K-BIT串行電可擦除可編程ROM
文件頁數(shù): 14/16頁
文件大小: 136K
代理商: IS93C66A
PACKAGING INFORMATION
ISSI
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. D
02/14/03
Copyright 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
300-mil Plastic DIP
Package Code: N,P
A
D
1
B
N
SEATING PLANE
C
A1
eA
L
e
B1
S
E1
E
S
FOR
32-PIN ONLY
B2
MILLIMETERS
INCHES
Sym.
Min.
Max.
Min.
Max.
N0.
Leads
8
A
A1
B
B1
B2
C
D
E
E1
3.68
0.38
0.36
1.14
0.81
0.20
9.12
7.62
6.20
4.57
0.56
1.52
1.17
0.33
9.53
8.26
6.60
0.145
0.015
0.014
0.045
0.032
0.008
0.359
0.300
0.244
0.180
0.022
0.060
0.046
0.013
0.375
0.325
0.260
eA
e
8.13
9.65
0.320
0.380
2.54 BSC
0.100 BSC
L
S
3.18
0.64
0.125
0.025
0.762
0.030
Notes:
1. Controlling dimension: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and
should
be measured from the bottom of the package
.
4. Formed leads shall be planar with respect to one another within 0.004
inches at the seating plane.
相關(guān)PDF資料
PDF描述
IS93C66A-2GRI 2K-BIT/4K-BIT SERIAL ELECTRICALLY ERASABLE PROM
IS93C66A-2GRLI 2K-BIT/4K-BIT SERIAL ELECTRICALLY ERASABLE PROM
IS93C66A-2PI 2K-BIT/4K-BIT SERIAL ELECTRICALLY ERASABLE PROM
IS93C66A-2PLI 2K-BIT/4K-BIT SERIAL ELECTRICALLY ERASABLE PROM
IS93C66A-2ZI 2K-BIT/4K-BIT SERIAL ELECTRICALLY ERASABLE PROM
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IS93C66A-2GRI 功能描述:電可擦除可編程只讀存儲器 1.8V 4Kb Industrial Temp RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數(shù)據(jù)保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8
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