參數(shù)資料
        型號: IS93C56A-3GRLA3
        廠商: INTEGRATED SILICON SOLUTION INC
        元件分類: DRAM
        英文描述: 2K-BIT/4K-BIT SERIAL ELECTRICALLY ERASABLE PROM
        中文描述: 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
        封裝: 0.150 INCH, LEAD FREE, PLASTIC, SOP-8
        文件頁數(shù): 14/16頁
        文件大?。?/td> 136K
        代理商: IS93C56A-3GRLA3
        PACKAGING INFORMATION
        ISSI
        Integrated Silicon Solution, Inc. — www.issi.com —
        1-800-379-4774
        Rev. D
        02/14/03
        Copyright 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
        without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
        obtain the latest version of this device specification before relying on any published information and before placing orders for products.
        300-mil Plastic DIP
        Package Code: N,P
        A
        D
        1
        B
        N
        SEATING PLANE
        C
        A1
        eA
        L
        e
        B1
        S
        E1
        E
        S
        FOR
        32-PIN ONLY
        B2
        MILLIMETERS
        INCHES
        Sym.
        Min.
        Max.
        Min.
        Max.
        N0.
        Leads
        8
        A
        A1
        B
        B1
        B2
        C
        D
        E
        E1
        3.68
        0.38
        0.36
        1.14
        0.81
        0.20
        9.12
        7.62
        6.20
        4.57
        0.56
        1.52
        1.17
        0.33
        9.53
        8.26
        6.60
        0.145
        0.015
        0.014
        0.045
        0.032
        0.008
        0.359
        0.300
        0.244
        0.180
        0.022
        0.060
        0.046
        0.013
        0.375
        0.325
        0.260
        eA
        e
        8.13
        9.65
        0.320
        0.380
        2.54 BSC
        0.100 BSC
        L
        S
        3.18
        0.64
        0.125
        0.025
        0.762
        0.030
        Notes:
        1. Controlling dimension: inches, unless otherwise specified.
        2. BSC = Basic lead spacing between centers.
        3. Dimensions D and E1 do not include mold flash protrusions and
        should
        be measured from the bottom of the package
        .
        4. Formed leads shall be planar with respect to one another within 0.004
        inches at the seating plane.
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