j x 45
參數(shù)資料
型號(hào)： IS82C55A-5Z96
廠商： Intersil
文件頁數(shù)： 20/29頁
文件大?。?/td> 0K
描述： IC I/O EXPANDER 24B 44PLCC
標(biāo)準(zhǔn)包裝： 500
接口： 可編程
輸入/輸出數(shù)： 24
中斷輸出： 無
電源電壓： 4.5 V ~ 5.5 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 44-LCC（J 形引線）
供應(yīng)商設(shè)備封裝： 44-PLCC
包裝： 帶卷 (TR)
27
FN2969.10
November 16, 2006
82C55A
Ceramic Leadless Chip Carrier Packages (CLCC)
D
j x 45o
D3
B
h x 45o
A
A1
E
L
L3
e
B3
L1
D2
D1
e1
E2
E1
L2
PLANE 2
PLANE 1
E3
B2
0.010
E H
S
0.010
E F
S
-E-
0.007
E F
M
S HS
B1
-H-
-F-
J44.A MIL-STD-1835 CQCC1-N44 (C-5)
44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.064
0.120
1.63
3.05
6, 7
A1
0.054
0.088
1.37
2.24
-
B
0.033
0.039
0.84
0.99
4
B1
0.022
0.028
0.56
0.71
2, 4
B2
0.072 REF
1.83 REF
-
B3
0.006
0.022
0.15
0.56
-
D
0.640
0.662
16.26
16.81
-
D1
0.500 BSC
12.70 BSC
-
D2
0.250 BSC
6.35 BSC
-
D3
-
0.662
-
16.81
2
E
0.640
0.662
16.26
16.81
-
E1
0.500 BSC
12.70 BSC
-
E2
0.250 BSC
6.35 BSC
-
E3
-
0.662
-
16.81
2
e
0.050 BSC
1.27 BSC
-
e1
0.015
-
0.38
-
2
h
0.040 REF
1.02 REF
5
j
0.020 REF
0.51 REF
5
L
0.045
0.055
1.14
1.40
-
L1
0.045
0.055
1.14
1.40
-
L2
0.075
0.095
1.90
2.41
-
L3
0.003
0.015
0.08
0.38
-
ND
11
3
NE
11
3
N44
44
3
Rev. 0 5/18/94
NOTES:
1. Metallized castellations shall be connected to plane 1 terminals
and extend toward plane 2 across at least two layers of ceramic
or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.
2. Unless otherwise specified, a minimum clearance of 0.015 inch
(0.38mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.)
3. Symbol “N” is the maximum number of terminals. Symbols “ND”
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.
4. The required plane 1 terminals and optional plane 2 terminals (if
used) shall be electrically connected.
5. The corner shape (square, notch, radius, etc.) may vary at the
manufacturer’s option, from that shown on the drawing.
6. Chip carriers shall be constructed of a minimum of two ceramic
layers.
7. Dimension “A” controls the overall package thickness. The maxi-
mum “A” dimension is package height before being solder dipped.
8. Dimensioning and tolerancing per ANSI Y14.5M-1982.
9. Controlling dimension: INCH.
相關(guān)PDF資料
PDF描述
ATMEGA8535-16AUR MCU AVR 8K FLASH 16MHZ 44TQFP
IS82C55A-5Z IC I/O EXPANDER 24B 44PLCC
CS82C55A-596 IC I/O EXPANDER 24B 44PLCC
CS82C55A-5 IC I/O EXPANDER 24B 44PLCC
ATMEGA8535L-8AUR MCU AVR 8K FLASH 8MHZ 44TQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IS82C55A96 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI PERIPH PRG-I/O 5V 8MHZ 44PLCC INDEL RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
IS82C55AR2490 制造商:Rochester Electronics LLC 功能描述:- Bulk
IS82C55AZ 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI PERI PRG-I/O 5V 8MHZ 44PLCC IND RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
IS82C55AZ 制造商:Intersil Corporation 功能描述:IC TRANSCEIVER 8V
IS82C55AZ96 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI PERI PRG-I/O 5V 8MHZ 44PLCC INDEL RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*