參數(shù)資料
型號: IS42S32200B-6T
廠商: INTEGRATED SILICON SOLUTION INC
元件分類: DRAM
英文描述: 512K Bits x 32 Bits x 4 Banks (64-MBIT) SYNCHRONOUS DYNAMIC RAM
中文描述: 2M X 32 SYNCHRONOUS DRAM, 5.5 ns, PDSO86
封裝: 0.400 INCH, PLASTIC, TSOP2-86
文件頁數(shù): 6/56頁
文件大小: 537K
代理商: IS42S32200B-6T
IS42S32200B
ISSI
6
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00C
09/29/03
TRUTH TABLE – COMMANDS AND DQM OPERATION
(1)
FUNCTION
CS
RAS
CAS
WE
DQM
ADDR
DQs
COMMAND INHIBIT (NOP)
H
X
X
X
X
X
X
NO OPERATION (NOP)
L
H
H
H
X
X
X
ACTIVE (Select bank and activate row)
(3)
L
L
H
H
X
Bank/Row
X
READ (Select bank/column, start READ burst)
(4)
L
H
L
H
L/H
(8)
Bank/Col
X
WRITE (Select bank/column, start WRITE burst)
(4)
L
H
L
L
L/H
(8)
Bank/Col
Valid
BURST TERMINATE
L
H
H
L
X
X
Active
PRECHARGE (Deactivate row in bank or banks)
(5)
L
L
H
L
X
Code
X
AUTO REFRESH or SELF REFRESH
(Enter self refresh mode)
(6,7)
L
L
L
H
X
X
X
LOAD MODE REGISTER
(2)
L
L
L
L
X
Op-Code
X
Write Enable/Output Enable
(8)
L
Active
Write Inhibit/Output High-Z
(8)
H
High-Z
NOTES:
1. CKE is HIGH for all commands except SELF REFRESH.
2. A0-A10 define the op-code written to the mode register.
3. A0-A10 provide row address, and BA0, BA1 determine which bank is made active.
4. A0-A7 (x32) provide column address; A10 HIGH enables the auto precharge feature (nonpersistent), while A10 LOW disables
auto precharge; BA0, BA1 determine which bank is being read from or written to.
5. A10 LOW: BA0, BA1 determine the bank being precharged. A10 HIGH: All banks precharged and BA0, BA1 are “Don’t Care.”
6. AUTO REFRESH if CKE is HIGH, SELF REFRESH if CKE is LOW.
7. Internal refresh counter controls row addressing; all inputs and DQs are “Don’t Care” except for CKE.
8. Activates or deactivates the DQs during WRITEs (zero-clock delay) and READs (two-clock delay).
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