參數(shù)資料
型號: IRU1260
廠商: International Rectifier
英文描述: DUAL 6A AND 1A LOW DROPOUT POSITIVE ADJUSTABLE REGULATOR
中文描述: 雙6A和1A低壓差型正,可調(diào)式穩(wěn)壓器
文件頁數(shù): 5/12頁
文件大?。?/td> 76K
代理商: IRU1260
IRU1260
5
Rev. 2.1
09/19/02
www.irf.com
Stability
The IRU1260 requires the use of an output capacitor as
part of the frequency compensation in order to make the
regulator stable. Typical designs for the microprocessor
applications use standard electrolytic capacitors with
typical ESR in the range of 50 to 100m
and the output
capacitance of 500 to 1000
μ
F. Fortunately as the ca-
pacitance increases, the ESR decreases resulting in a
fixed RC time constant. The IRU1260 takes advantage
of this phenomena in making the overall regulator loop
stable. For most applications a minimum of 100
μ
F alu-
minum electrolytic capacitor with the maximum ESR of
0.3
such as Sanyo, MVGX series, Panasonic FA se-
ries as well as the Nichicon PL series insures both sta-
bility and good transient response. The IRU1260 also
requires a 1
μ
F ceramic capacitor connected from V
IN
to
V
CTRL
and a 10
, 0.1W resistor in series with V
CTRL
pin
in order to further insure stability.
Thermal Design
The IRU1260 incorporates an internal thermal shutdown
that protects the device when the junction temperature
exceeds the maximum allowable junction temperature.
Although this device can operate with junction tempera-
tures in the range of 150
8
C, it is recommended that the
selected heat sink be chosen such that during maxi-
mum continuous load operation the junction tempera-
ture is kept below this number. The example given shows
the steps in selecting the proper regulator heat sink for
driving the Pentium
II
TM
processor GTL+ termination
resistors and the Clock IC using the IRU1260 TO-263
package.
Example
:
Assuming the following specifications:
The steps for selecting a proper heat sink to keep the
junction temperature below 135
8
C is given as:
1) Calculate the maximum power dissipation using:
2) Assuming a TO-263 surface mount package, the junc-
tion to ambient thermal resistance of the package is:
3) The maximum junction temperature of the device is
calculated using the equation below:
Since this is lower than our selected 135
8
C maxi-
mum junction temperature (150
8
C is the thermal shut-
down of the device), TO-263 package is a suitable
package for our application.
V
IN
= 3.3V
V
OUT1
= 2.5V
V
OUT2
= 1.5V
I
OUT1(MAX)
= 0.2A
I
OUT2(MAX)
= 1.5A
T
A
= 35
8
C
P
D
= I
OUT1
×
(V
IN
- V
OUT1
) + I
OUT2
×
(V
IN
- V
OUT2
)
P
D
= 0.2
×
(3.3 - 2.5) + 1.5
×
(3.3 - 1.5) = 2.86W
θ
JA
= 30
8
C/W for 1" square pad area
T
J
= T
A
+ P
D
×θ
JA
T
J
= 35 + 2.86
×
30 = 121
8
C
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