參數(shù)資料
型號(hào): IRHM2C50SE
元件分類(lèi): JFETs
英文描述: 10 A, 600 V, 0.6 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-254AA
文件頁(yè)數(shù): 2/8頁(yè)
文件大小: 98K
代理商: IRHM2C50SE
IRHM2C50SE, IRHM7C50SE Devices
Pre-Irradiation
2
www.irf.com
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter
Min
Typ Max Units
Test Conditions
BVDSS
Drain-to-Source Breakdown Voltage
600
V
VGS = 0V, ID = 1.0mA
BVDSS/TJ Temperature Coefficient of Breakdown
0.6
V/°C
Reference to 25°C, ID = 1.0mA
Voltage
RDS(on)
Static Drain-to-Source
0.60
VGS = 12V, ID = 6.5A
On-State Resistance
0.65
VGS = 12V, ID = 10.4A
VGS(th)
Gate Threshold Voltage
2.5
4.5
V
VDS = VGS, ID = 1.0mA
gfs
Forward Transconductance
3.0
S ( )VDS > 15V, IDS = 6.5A
IDSS
Zero Gate Voltage Drain Current
50
VDS= 0.8 x Max Rating,VGS=0V
250
VDS = 0.8 x Max Rating
VGS = 0V, TJ = 125°C
IGSS
Gate-to-Source Leakage Forward
100
VGS = 20V
IGSS
Gate-to-Source Leakage Reverse
-100
VGS = -20V
Qg
Total Gate Charge
150
VGS = 12V, ID = 10.4A
Qgs
Gate-to-Source Charge
30
nC
VDS = Max Rating x 0.5
Qgd
Gate-to-Drain (‘Miller’) Charge
75
td(on)
Turn-On Delay Time
28
VDD = 300V, ID = 10.4A,
tr
Rise Time
75
RG = 2.35
td(off)
Turn-Off Delay Time
75
tf
Fall Time
75
LD
Internal Drain Inductance
8.7
LS
Internal Source Inductance
8.7
Ciss
Input Capacitance
2510
VGS = 0V, VDS = 25V
Coss
Output Capacitance
400
pF
f = 1.0MHz
Crss
Reverse Transfer Capacitance
110
nA
nH
ns
Measured from drainlead,
6mm (0.25 in) from package
tocenterofdie.
Measured from source lead,
6mm (0.25 in) from package
to source bonding pad.
Modified MOSFET symbol show-
ingtheinternal inductances.
A
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ Max Units
Test Conditions
IS
Continuous Source Current (Body Diode)
10.4
Modified MOSFET symbol showingtheintegra
l
ISM
Pulse Source Current (Body Diode)
41.6
r
eversep-njunctionrectifier.
VSD
Diode Forward Voltage
1.6
V
Tj = 25°C, IS = 10.4A, VGS = 0V
trr
Reverse Recovery Time
750
ns
Tj = 25°C, IF = 10.4A, di/dt ≤ 100A/s
QRR
Reverse Recovery Charge
9.8
CVDD ≤ 50V
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
A
Thermal Resistance
Parameter
Min Typ Max
Units
Test Conditions
RthJC
Junction-to-Case
0.83
RthCS
Case-to-Sink
0.21
°C/W
RthJA
Junction-to-Ambient
48
Typical socket mount
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