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參數(shù)資料
| 型號(hào)： | IR3088AM |
| 廠商： | International Rectifier |
| 英文描述： | XPHASETM PHASE IC WITH FAULT AND OVERTEMP DETECT |
| 中文描述： | XPHASETM相集成電路及超溫故障檢測(cè) |
| 文件頁數(shù)： | 32/34頁 |
| 文件大?。?/td> | 1264K |
| 代理商： | IR3088AM |
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IR3088A
Solder Resist
The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non Solder
Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
The minimum solder resist width is 0.13mm, therefore it is recommended that the solder resist is completely
removed from between the lead lands forming a single opening for each “group” of lead lands.
At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
fillet so a solder resist width of
≥
0.17mm remains.
The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto the
copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable to have
the solder resist opening for the land pad to be smaller than the part pad.
Ensure that the solder resist in-between the lead lands and the pad land is
≥
0.15mm due to the high aspect
ratio of the solder resist strip separating the lead lands from the pad land.
The 4 vias in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than the
diameter of the via.
Page 32 of 34
9/30
/04
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| IR3088AMPBF | 功能描述:IC XPHASE CONTROL 20L-MLPQ RoHS:是 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:XPhase™ 應(yīng)用說明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:37 系列:- 應(yīng)用:醫(yī)療用超聲波成像，聲納 電流 - 電源:- 電源電壓:2.37 V ~ 6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:56-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-TQFN-EP（8x8） 包裝:管件 |
| IR3088AMTR | 功能描述:IC XPHASE W/FAULT DET 20L-MLPQ RoHS:否 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:XPhase™ 應(yīng)用說明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:37 系列:- 應(yīng)用:醫(yī)療用超聲波成像，聲納 電流 - 電源:- 電源電壓:2.37 V ~ 6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:56-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-TQFN-EP（8x8） 包裝:管件 |
| IR3088AMTRPBF | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 XPHASE IC W/ FAULT OVERTEMP DETECT RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
| IR3088APBF | 制造商:IRF 制造商全稱:International Rectifier 功能描述:XPHASETM PHASE IC WITH FAULT AND OVERTEMP DETECT |
| IR3088M | 功能描述:IC XPHASE W/FAULT DET 20L-MLPQ RoHS:否 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:XPhase™ 應(yīng)用說明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:37 系列:- 應(yīng)用:醫(yī)療用超聲波成像，聲納 電流 - 電源:- 電源電壓:2.37 V ~ 6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:56-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-TQFN-EP（8x8） 包裝:管件 |
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