參數(shù)資料
型號(hào)： IR3082MTR
廠商： International Rectifier
英文描述： XPHASE AMD OPTERON/ATHLON 64 CONTROL IC
中文描述： XPHASE AMD皓龍/速龍64控制IC
文件頁(yè)數(shù)： 30/33頁(yè)
文件大小： 444K
代理商： IR3082MTR
IR3082
Page 30 of 30
12/17/04
METAL AND SOLDER RESIST
The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non
Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
The minimum solder resist width is 0.13mm, therefore it is recommended that the solder resist is
completely removed from between the lead lands forming a single opening for each “group” of lead
lands.
At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
fillet so a solder resist width of
≥
0.17mm remains.
The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
the copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable
to have the solder resist opening for the land pad to be smaller than the part pad.
Ensure that the solder resist in-between the lead lands and the pad land is
≥
0.15mm due to the high
aspect ratio of the solder resist strip separating the lead lands from the pad land.
The single via in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than
the diameter of the via.
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參數(shù)描述
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IR3084 制造商:IRF 制造商全稱:International Rectifier 功能描述:XPHASETM VR 10/11 CONTROL IC
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