18
FN2969.10
November 16, 2006
Absolute Maximum Ratings TA = +25°C
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V
Input, Output or I/O Voltage . . . . . . . . . . . . . GND-0.5V to VCC+0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to 5.5V
Operating Temperature Range
CX82C55A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
IX82C55A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
MX82C55A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to 125°C
Die Characteristics
Gate Count. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 Gates
Thermal Resistance (Typical, Note 1)
θJA (°C/W) θJC(°C/W)
CERDIP Package. . . . . . . . . . . . . . . . .
50
10
CLCC Package . . . . . . . . . . . . . . . . . .
65
14
PDIP Package . . . . . . . . . . . . . . . . . . .
50
N/A
PLCC Package. . . . . . . . . . . . . . . . . . .
55
N/A
MQFP Package . . . . . . . . . . . . . . . . . .
62
N/A
Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C
Maximum Junction Temperature
CDIP Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C
PDIP Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
(PLCC and MQFP Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
VCC = 5.0V ±10%; TA = Operating Temperature Range
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
MAX
UNITS
VIH
Logical One Input Voltage
2.0
2.2
-V
VIL
Logical Zero Input Voltage
-0.8
V
VOH
Logical One Output Voltage
IOH = -2.5mA,
IOH = -100μA
3.0
VCC -0.4
-V
VOL
Logical Zero Output Voltage
IOL +2.5mA
-
0.4
V
II
Input Leakage Current
VIN = VCC or GND, RD, CS, A1, A0, RESET, WR
-1.0
+1.0
μA
IO
I/O Pin Leakage Current
VO = VCC or GND, D0 - D7
-10
+10
μA
IBHH
Bus Hold High Current
VO = 3.0V. Ports A, B, C
TA = -55°C
-50
-450
μA
TA = +128°C
-50
-400
μA
IBHL
Bus Hold Low Current
VO = 1.0V. Port A ONLY
TA = -55°C
50
450
μA
TA = +128°C
50
400
μA
IDAR
Darlington Drive Current
Ports A, B, C. Test Condition 3
-2.5
Note 2, 4
mA
ICCSB
Standby Power Supply Current
VCC = 5.5V, VIN = VCC or GND. Output Open
-
10
μA
ICCOP
Operating Power Supply Current
TA = +25°C, VCC = 5.0V, Typical (See Note 3)
-
1
mA/MHz
NOTES:
2. No internal current limiting exists on Port Outputs. A resistor must be added externally to limit the current.
3. ICCOP = 1mA/MHz of Peripheral Read/Write cycle time. (Example: 1.0
μs I/O Read/Write cycle time = 1mA).
4. Tested as VOH at -2.5mA.
Capacitance TA = +25°C
SYMBOL
PARAMETER
TYPICAL
UNITS
TEST CONDITIONS
CIN
Input Capacitance
10
pF
FREQ = 1MHz, All Measurements are referenced to
device GND
CI/O
I/O Capacitance
20
pF
82C55A