
Orderable Device
Status
(1)
Package
Type
SSOP/
QSOP
SSOP/
QSOP
SSOP/
QSOP
PDIP
Package
Drawing
DBQ
Pins Package
Qty
250
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
INA2126EA/250G4
ACTIVE
16
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
48
Pb-Free
(RoHS)
48
Green (RoHS &
no Sb/Br)
2500
Pb-Free
(RoHS)
2500
Pb-Free
(RoHS)
48
Pb-Free
(RoHS)
48
Green (RoHS &
no Sb/Br)
48
Pb-Free
(RoHS)
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-3-260C-168 HR
INA2126EA/2K5
ACTIVE
DBQ
16
CU NIPDAU
Level-3-260C-168 HR
INA2126EA/2K5G4
ACTIVE
DBQ
16
CU NIPDAU
Level-3-260C-168 HR
INA2126P
ACTIVE
N
16
Call TI
N / A for Pkg Type
INA2126PA
ACTIVE
PDIP
N
16
Call TI
N / A for Pkg Type
INA2126PAG4
ACTIVE
PDIP
N
16
Call TI
N / A for Pkg Type
INA2126PG4
ACTIVE
PDIP
N
16
Call TI
N / A for Pkg Type
INA2126U
ACTIVE
SOIC
D
16
CU NIPDAU
Level-3-260C-168 HR
INA2126UA
ACTIVE
SOIC
D
16
CU NIPDAU
Level-3-260C-168 HR
INA2126UA/2K5
ACTIVE
SOIC
D
16
CU NIPDAU
Level-3-260C-168 HR
INA2126UA/2K5E4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-3-260C-168 HR
INA2126UAE4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-3-260C-168 HR
INA2126UAG4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-3-260C-168 HR
INA2126UE4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-3-260C-168 HR
SN200501036DRE4
ACTIVE
SOIC
D
16
CU NIPDAU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2007
Addendum-Page 2