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參數(shù)資料
| 型號(hào)： | INA-54063-TR1 |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; Body Material:Aluminum; Series:PT06; Number of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Circular Contact Gender:Pin; Insert Arrangement:10-98 |
| 中文描述： | 3.0千兆赫硅單片低噪聲放大器 |
| 文件頁(yè)數(shù)： | 8/10頁(yè) |
| 文件大小： | 117K |
| 代理商： | INA-54063-TR1 |
6-170
board and components to prevent
thermal shock and begin evapo-
rating solvents from the solder
paste. The reflow zone briefly
elevates the temperature suffi-
ciently to produce a reflow of the
solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to
components due to thermal
Figure 17. Surface Mount Assembly Profile.
TIME (seconds)
T
MAX
T
°
C
0
0
50
100
150
200
250
60
Preheat
Zone
Cool Down
Zone
Reflow
Zone
120
180
240
300
shock. The maximum tempera-
ture in the reflow zone (T
MAX
)
should not exceed 235
°
C.
These parameters are typical for
a surface mount assembly
process for the INA-54063. As a
general guideline, the circuit
board and components should be
exposed only to the minimum
temperatures and times necessary
to achieve a uniform reflow of
solder.
Electrostatic Sensitivity
RFICs are electro-
static discharge
(ESD) sensitive
devices. Although the
INA-54063 is robust in design,
permanent damage may occur to
these devices if they are sub-
jected to high energy electrostatic
discharges. Electrostatic charges
as high as several thousand volts
(which readily accumulate on the
human body and on test equip-
ment) can discharge without
detection and may result in
degradation in performance,
reliability, or failure. Electronic
devices may be subjected to ESD
damage in any of the following
areas:
Storage and handling
Inspection and testing
Assembly
In-circuit use
The INA-54063 is an ESD Class 1
device. Therefore, proper ESD
precautions are recommended
when handling, inspecting,
testing, assembling, and using
these devices to avoid damage.
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