參數(shù)資料
型號(hào): IMST425G30S
英文描述: Peripheral IC
中文描述: 外圍芯片
文件頁數(shù): 60/74頁
文件大小: 563K
代理商: IMST425G30S
IMS T400
/ 74
60
D I M E N S I O N S
REF.
CONTROL DIM. mm
Min
0.05
1.35
0.17
15.75
13.95
15.75
13.95
0
5
0.50
ALTERNATIVEDIM. INCHES
Min
Nom
0.002
0.053
0.055
0.007
0.620
0.630
0.549
0.551
0.472
0.620
0.630
0.549
0.551
0.472
0.020
0
5
0.020
0.024
Notes
Nom
1.4
16.00
14.00
12.00
16.00
14.00
12.00
0.500
Max
1.60
0.15
1.45
0.27
0.17
16.25
14.05
16.25
14.05
0.08
7
5
0.75
Max
0.063
0.006
0.057
0.011
0.007
0.640
0.553
0.640
0.553
0.0032
7
5
0.030
A
A1
A2
B
C
D
D1
D3
E
E1
E3
e
G
K
REF
BSC
L
0.60
Notes
:
1 Lead finish to be 60Sn/40Pb solder plate.
2 Maximum lead displacement from the notional centre line will be no greater than
+
0.08mm.
9.5
Thermal specification
The IMST400istestedtoa maximumsilicontemperature of100 C.For operationwithinthegiven specifi-
cations, the case temperature should not exceed 85 C.
For temperatures above 85 C the operation of the device cannot be guaranteed and reliability may be
impaired.
For further information on reliability refer to the SGS–THOMSONMicroelectronics Quality and Reliability
Program.
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