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參數(shù)資料
| 型號(hào)： | IDTAMB0483D0RJ8 |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC MEMORY BUFFER ADV DIMM 655BGA |
| 標(biāo)準(zhǔn)包裝： | 650 |
| 系列： | * |
| 其它名稱： | AMB0483D0RJ8 |
IDTADVANCEDMEMORYBUFFER(AMB)
IDTADVANCEDMEMORYBUFFER(AMB)
Improve FB-DIMM Performance
with IDT Advanced Memory Buffers
AdvancedMemoryBuffers,thenextgenerationofFDIMMcontrollers,allowmoreDIMMSinasingle
system,idealforservers,workstations,storagedevicesandcommunicationapplications.Theunique
channelstructureoftheIDTAMBchipalleviatesbufferloadingissues.TheIDTAMB+familyoffers
unparalleledpowersavingoverstandardAMB,whichtranslatesintoadramaticimprovementinoverall
costandenergyefficiency.
The essential building block for next-generation,
high-bandwidth applications
The fully buffered dual in-line memory module (FB-DIMM) is the next generation memory architecture
to meet the growing memory requirement of servers and workstations. The IDT advanced memory buffer
(AMB) chip is the essential building block located on each FB-DIMM. The IDT AMB receives commands
and data from the host controller to control and write/read data to/from the DRAMs on the DIMM. Commands
and write data are sent southbound from the host controller to AMBs in a daisy chain fashion and interpreted
by the target AMB. Status and read data are sent northbound from AMBs to the host controller also in a daisy
chain fashion, passing through non-target AMBs. This unique channel structure alleviates buffer loading
issues common in registered DIMM technology, enabling designers to use a large number of DIMMs
within a single system. The IDT AMB complies with the latest JEDEC specification for AMB and supports
DDR2-533/667/800 DRAM. It also enables serial data transfer at 3.2, 4.0 and 4.8 Gbps. The IDT AMB supports
servers, workstations, storage devices and communication applications that support the next generation
FB-DIMM architecture.
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IDT ADVANCED MEMORY BUFFER (AMB)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IDTAMB0680L4RJ8 | IC MEMORY BUFFER ADV DIMM 655BGA |
| IDTAMB0482C1RJ8 | IC MEMORY BUFFER ADV DIMM 655BGA |
| MS27468T23B21S | CONN RCPT 21POS JAM NUT W/SCKT |
| D38999/26JJ24PA | CONN PLUG 24POS STRAIGHT W/PINS |
| D38999/26MJ43SN | CONN PLUG 43POS STRAIGHT W/SCKT |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IDTAMB0582C1RJ | 功能描述:IC MEMORY BUFFER ADV DIMM 655BGA RoHS:否 類別:集成電路 (IC) >> 接口 - 信號(hào)緩沖器，中繼器，分配器 系列:* 標(biāo)準(zhǔn)包裝:160 系列:- 類型:轉(zhuǎn)發(fā)器 Tx/Rx類型:以太網(wǎng) 延遲時(shí)間:- 電容 - 輸入:- 電源電壓:2.37 V ~ 2.63 V 電流 - 電源:60mA 安裝類型:表面貼裝 封裝/外殼:64-TQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:64-TQFP-EP（10x10） 包裝:托盤 其它名稱:Q5134101 |
| IDTAMB0582C1RJ8 | 功能描述:IC MEMORY BUFFER DIMM 655FCBGA RoHS:否 類別:集成電路 (IC) >> 接口 - 信號(hào)緩沖器，中繼器，分配器 系列:* 標(biāo)準(zhǔn)包裝:160 系列:- 類型:轉(zhuǎn)發(fā)器 Tx/Rx類型:以太網(wǎng) 延遲時(shí)間:- 電容 - 輸入:- 電源電壓:2.37 V ~ 2.63 V 電流 - 電源:60mA 安裝類型:表面貼裝 封裝/外殼:64-TQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:64-TQFP-EP（10x10） 包裝:托盤 其它名稱:Q5134101 |
| IDTAMB0680L4RJ | 功能描述:IC MEMORY BUFFER ADV DIMM 655BGA RoHS:否 類別:集成電路 (IC) >> 接口 - 信號(hào)緩沖器，中繼器，分配器 系列:* 標(biāo)準(zhǔn)包裝:160 系列:- 類型:轉(zhuǎn)發(fā)器 Tx/Rx類型:以太網(wǎng) 延遲時(shí)間:- 電容 - 輸入:- 電源電壓:2.37 V ~ 2.63 V 電流 - 電源:60mA 安裝類型:表面貼裝 封裝/外殼:64-TQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:64-TQFP-EP（10x10） 包裝:托盤 其它名稱:Q5134101 |
| IDTAMB0680L4RJ8 | 功能描述:IC MEMORY BUFFER ADV DIMM 655BGA RoHS:否 類別:集成電路 (IC) >> 接口 - 信號(hào)緩沖器，中繼器，分配器 系列:* 標(biāo)準(zhǔn)包裝:160 系列:- 類型:轉(zhuǎn)發(fā)器 Tx/Rx類型:以太網(wǎng) 延遲時(shí)間:- 電容 - 輸入:- 電源電壓:2.37 V ~ 2.63 V 電流 - 電源:60mA 安裝類型:表面貼裝 封裝/外殼:64-TQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:64-TQFP-EP（10x10） 包裝:托盤 其它名稱:Q5134101 |
| IDTAMB0780L4RJ | 功能描述:IC MEMORY BUFFER ADV DIMM 655BGA RoHS:否 類別:集成電路 (IC) >> 接口 - 信號(hào)緩沖器，中繼器，分配器 系列:* 標(biāo)準(zhǔn)包裝:160 系列:- 類型:轉(zhuǎn)發(fā)器 Tx/Rx類型:以太網(wǎng) 延遲時(shí)間:- 電容 - 輸入:- 電源電壓:2.37 V ~ 2.63 V 電流 - 電源:60mA 安裝類型:表面貼裝 封裝/外殼:64-TQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:64-TQFP-EP（10x10） 包裝:托盤 其它名稱:Q5134101 |
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