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參數(shù)資料
| 型號： | IDT89HPES8T5ZHBCG |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數(shù)： | 7/31頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PCI SW 8LANE 5PORT 324-BGA |
| 標(biāo)準(zhǔn)包裝： | 84 |
| 系列： | PRECISE™ |
| 類型： | PCI Express 開關(guān) - Gen1 |
| 應(yīng)用： | 服務(wù)器，儲存，通信，嵌入式，消費品 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 324-LBGA |
| 供應(yīng)商設(shè)備封裝： | 324-CABGA（19x19） |
| 包裝： | 托盤 |
| 其它名稱： | 89HPES8T5ZHBCG |
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March 27, 2008
IDT 89HPES8T5 Data Sheet
Recommended Operating Temperature
Power Consumption
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 13
(and also listed below).
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
Table 13 (and also listed below).
Thermal Considerations
This section describes thermal considerations for the PES8T5 (19mm2 BCG324 package). The data in Table 16 below contains information that is
relevant to the thermal performance of the PES8T5 switch.
Note: The parameter θJA(eff) is not the absolute thermal resistance for the package as defined by JEDEC (JESD-51). Because resistance
can vary with the number of board layers, size of the board, and airflow, θJA(eff) is the effective thermal resistance. The values for effective
θJA given above are based on a 10-layer, standard height, full length (4.3”x12.2”) PCIe add-in card.
Grade
Temperature
Commercial
0
°C to +70°C Ambient
Table 14 PES8T5 Operating Temperatures
Number of active
Lanes per Port
Core Supply
PCIe Digital
Supply
PCIe Analog
Supply
PCIe Termin-
ation Supply
I/O Supply
Total
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
1.5V
Max
1.575V
Typ
3.3V
Max
3.6V
Typ
Power
Max
Power
4/1/1/1/1
mA
641
792
637
732
331
352
201
225
1
1.9W
2.4W
Watts
0.641
0.871
0.637
0.805
0.331
0.387
0.302
0.354
0.003
0.004
1/1/1/1/1
mA
632
744
574
668
325
346
137
155
1
1.75W
2.2W
Watts
0.632
0.818
0.574
0.735
0.325
0.381
0.206
0.244
0.003
0.0035
Table 15 PES8T5 Power Consumption
Symbol
Parameter
Value
Units
Conditions
TJ(max)
Junction Temperature
125
oCMaximum
TA(max)
Ambient Temperature
70
oC
Maximum for commercial-rated products
θJA(effective)
Effective Thermal Resistance, Junction-to-Ambient
21.8
oC/W
Zero air flow
15.1
oC/W
1 m/S air flow
13.9
oC/W
2 m/S air flow
θJB
Thermal Resistance, Junction-to-Board
11.4
oC/W
θJC
Thermal Resistance, Junction-to-Case
5.1
oC/W
P
Power Dissipation of the Device
2.4
Watts
Maximum
Table 16 Thermal Specifications for PES8T5, 19x19 mm BCG324 Package
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