- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄1925 > IDT89HPES32T8ZHBXG (IDT, Integrated Device Technology Inc)IC PCI SW 32LANE 8PORT 500-SBGA PDF資料下載
參數(shù)資料
| 型號： | IDT89HPES32T8ZHBXG |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數(shù)： | 10/37頁 |
| 文件大小： | 0K |
| 描述： | IC PCI SW 32LANE 8PORT 500-SBGA |
| 標準包裝： | 27 |
| 系列： | PRECISE™ |
| 類型： | PCI Express 開關(guān) - Gen1 |
| 應(yīng)用： | 服務(wù)器，儲存，通信，嵌入式，消費品 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 500-LBGA |
| 供應(yīng)商設(shè)備封裝： | 500-SBGA（31x31） |
| 包裝： | 托盤 |
| 其它名稱： | 89HPES32T8ZHBXG |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁當前第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁
18 of 37
March 25, 2008
IDT 89PES32T8 Data Sheet
Heat Sink
Table 17 lists heat sink requirements for the PES32T8 under three common usage scenarios. As shown in this table, a heat sink is not required in
most cases.
Thermal Usage Examples
The junction-to-ambient thermal resistance is a measure of a device’s ability to dissipate heat from the die to its surroundings in the absence of a
heat sink. The general formula to determine
θJA is:
θJA = (TJ - TA)/P
Thermal reliability of a device is generally assured when the actual value of TJ in the specific system environment being considered is less than the
maximum TJ specified for the device. Using an ambient temperature of 70oC and assuming a system with 1m/S airflow, the actual value of TJ is:
TJ(actual) = TA + P * θJA(eff) = 70oC + 5.0W * 7.6W/oC = 108oC
The actual TJ of 108oC is well below the maximum TJ of 125oC specified for the device (shown in Table 16). Therefore, no heat sink is needed in
this scenario. The formula is also useful from a system design perspective. It can be used to determine if a heat sink should be added to the device
based on some desired value of TJ. For example, if for reliability purposes the desired TJ is 100oC, then the maximum allowable TA is:
TA(allowed) = TJ(desired) - (P * θJA(effective))
TA(allowed) = 100oC - (5.0W * 7.6W/oC) = 100oC - 38oC = 62oC
An appropriate level of increased air flow and/or a heat sink can be added to achieve this lower ambient temperature. Please contact
ssdhelp@idt.com for further assistance.
Air Flow
Board Size
Board Layers
Heat Sink Requirement
Zero
4.3”x6.6” (PCIe standard height, half length form factor)
10 or more
No heat sink required
Zero
3.9”x6.2” (ExpressModule form factor)
14 or more
No heat sink required
1 m/S or more
Any
No heat sink required
Table 17 Heat Sink Requirements Based on Air Flow and Board Characteristics
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IDT89HPES8NT2ZBBCG | IC PCI SW 8LANE 2PORT 324-CABGA |
| IDT89HPES8T5ZHBCG | IC PCI SW 8LANE 5PORT 324-BGA |
| IDTAMB0780L4RJ | IC MEMORY BUFFER ADV DIMM 655BGA |
| IDTHS231P16NDGI | IC SWITCH DUAL SPST 16QFN |
| IDTQS33X257Q1G | IC MUX/DEMUX QUAD 1X2 48QVSOP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IDT89HPES34H16ZABL | 功能描述:IC PCI SW 34LANE 16PORT 1156FBGA RoHS:否 類別:集成電路 (IC) >> 專用 IC 系列:PRECISE™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝 |
| IDT89HPES34H16ZABLG | 制造商:Integrated Device Technology Inc 功能描述:IC PCIE SW 34LANE 16PORT 1156BGA |
| IDT89HPES34H16ZABLGI | 制造商:Integrated Device Technology Inc 功能描述:IC PCIE SW 34LANE 16PORT 1156BGA |
| IDT89HPES34H16ZABLI | 功能描述:IC PCI SW 34LANE 16PORT 1156FBGA RoHS:否 類別:集成電路 (IC) >> 專用 IC 系列:PRECISE™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝 |
| IDT89HPES34H16ZABR | 功能描述:IC PCI SW 34LANE 16PORT 1156FBGA RoHS:否 類別:集成電路 (IC) >> 專用 IC 系列:PRECISE™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。