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參數(shù)資料
型號(hào): IDT89H24NT24G2ZBHLG
廠商: IDT, Integrated Device Technology Inc
文件頁(yè)數(shù): 3/4頁(yè)
文件大?。?/td> 0K
描述: IC PCI SW 24LANE 24PORT 324BGA
標(biāo)準(zhǔn)包裝: 84
類型: PCI Express 開關(guān) - Gen2
應(yīng)用: 服務(wù)器,儲(chǔ)存,通信,嵌入式,消費(fèi)品
安裝類型: 表面貼裝
封裝/外殼: 324-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 324-FCBGA(19x19)
包裝: 托盤
Clock
Memory
Clock
Switch
CPU
Memory
P Mezzanine
To Backplane
NTB
CPU
IDT | THE ANALOG + DIGITAL COMPANY
2
3
ComprehensivePortfoliofromtheLeaderinPCIExpressSolutions
IDT PCI EXPRESS PRODUCT OVERVIEW
Integrated DeviceTechnology
PCI Express Switches
Featuring Dual DMA, Multiple NTB, Multicast; Configurations 3 to 64 Lanes and 3 to 24 Ports
PCI Express Bridges
PCI Express Signal Integrity Products
IDTprovidestheindustry’smostcomprehen-
sivefamilyofhighperformance,scalablePCI
Expressswitchingsolutions.PCIeGen1,Gen2
andGen3switchingsolutionsareoptimizedby
applicationtomaximizeperformanceperwatt
forthemostdemandingapplications.
IDT“I/OExpansionPCIeSwitches”arecom-
monlyusedtoconnectasingleRootComplex
toI/Odevicesandadd-incards.Inthisusage
model,themajorityoftrafficflowsbetweenthe
RootComplexandtheI/Odevices.
TheotherprimaryusagemodelisusingaPCIe
switchasanembeddedsystemfabricreferred
toas“SystemInterconnectSwitch,”whichuti-
lizesahighdegreeofpeer-to-peertraffic.The
SystemInterconnectSwitchiscapableofPCIe
domainisolation,whichmayinvolveconnect-
ing multiple processing endpoints or simply
providingaredundantbackplanearchitecture.
PCIe to PCI and PCI-X Bus Standards
Tocomplementtheswitchproducts,IDT
offers bridges to connect PCIe to the
PCI and PCI-X bus standards. A PCIe
bridgeisusedforbridgingdevicesthat
use the PCI/X interface to provide a
PCIeconnectiontoahostprocessoror
rootcomplex.ApplicationsincludePCIe
adapter cards, embedded computing,
and motherboards to provide connec-
tiontoPCI/XdevicesoradditionalPCI/X
expansionslots.
PCIe Gen 3 and Gen2 Standards
With the increase of signal speeds in the
computing, storage and communications
applications,systemdesignersincreasingly
face signal integrity challenges. Signal In-
tegrity Product (SIP) components provide
signal conditioning for applications up to
8Gbps, PCI Express 3.0, delivering signal
quality over extended distances while of-
feringsimplifieddesignbyalleviatingboard
layoutconstraints.
Thesedevicesincorporateadvancedreceive
equalizationandtransmitde-emphasiscapa-
bilities, as well as diagnostic features that
helpIDTcustomersachieveasimplifiedde-
signwithfastertime-to-market.Specifically,
thedevicesdrivelongon-boardtraces,back-
planetracesandcablestoexternaldevices
toensureoptimumsystemperformance.The
devicesallofferpowersavingsmodesforthe
lowest-possiblepowerconsumption.
FEATURES
Mostadvancedswitching
architectureavailable
–Switchpartitioning
–Adaptivecut-throughlatency
–Requestmetering
–Largeflowcontrolcredits
andbuffers
Enablesmulti-domaincommunication
inmulti-rootapplications
–MultipleNon-Transparent
Bridgefunctions
–Multi-porttimingdomainand
SpreadSpectrumClocksupport
–Multicast
– DualDMAcontrollers
FEATURES
ComplianttoPCIe1.1specification
Lowlatency&highthroughput
features
Proveninteroperability
Smallfootprintpackages
Simplepowersupplyrequirements
Comprehensivedesigntools
FEATURES
Extendstraceover60inches,
andcableover10meters
EliminatesDeterministicJitter(Dj),
RandomJitter(Rj)andISI
(Inter-SymbolInterference)
Optimizessystemperformance
byreducinglostpackets
Bettersystemreliabilitywith
increasedsignalvoltageand
timingmargins
Simplifiessystemdesignand
time-to-market
PCIe
Backplane
CPU
I / O
Server Blade(s)
SIP
CPU
I / O
Server Blade(s)
SIP
Part Number*
Channels
Pin config.
I2C config.
Package
Pins
PCIe3.0Retimers
89HT0808PZAAB
8
N
Y
BGA
100
89HT0816PZABC
16
N
Y
BGA
196
PCIe2.1Repeaters
89HP0504PZBNR
4
N
Y
QFN
36
89HP0504PZBAB
4
Y
BGA
100
89HP0504PBZBNR
4
Y
N
QFN
36
89HP0508PZBAB
8
N
Y
BGA
100
* Additional products and information available — www.idt.com/go/PCIeSwitches
* Additional products and information available — www.idt.com/go/PCIeBridges
* Additional products and information available — www.idt.com/go/PCIeSIP
Clock
CPU
Memory
Clock
Switch
Bridge
Chipset
Example: I/O Expansion Server Motherboard
Example: Signal Conditioner Use
Example: System Interconnect Embedded Blade
PEB383
CPU
Processor
Chipset
Peripherals
Memory
Graphics
PCIe Slot
PCIe
PCI
Tsi384
GbE/FC
Controller
GbE/FC
Controller
PCI-X 133 MHz
PCIe x4
10x10 mm
footprint supports
up to four PCI
devices off x1 PCIe
Bridge
Part
Number*
PCIe
PCI
Short
Term
Caching
External
Master
Support
Non-
Transparent
Bridging
Power
Package Size
(mm)
PCIe to PCI
PEB383
x1 Gen1
32/66
4
450 mW
130 mW standby
14x14 QFP
10X10 QFN
PCIe to PCI
Tsi382
x1 Gen1
32/66
4
700 mW
20x20 QFP
10x10 PBGA
PCIe to PCI
Tsi381
x1 Gen1
32/66
4
700 mW
13x13 PBGA
PCIe to PCI-X
Tsi384
x4 Gen1
64/133
4
1.3 W
17x17 PBGA
PCI-X to PCI-X
Tsi310
64/133
4
6
3.0 W
31x31 BGA
PCI to PCI
Tsi352
32/66
4
0.5 W
32x32 QFP
PCI to PCI
Tsi350A
32/66
9
1.0 W
25x25 QFP
15x15 BGA
PCI to PCI
Tsi340
32/66
4
0.5 W
23x17 mm QFP
Example: Storage HBA
Contact an IDT representative for details on pin compatibility with comparable solutions.
Example: Motherboard Application
Part
Number
*
PCIe
Specification
Lanes
Ports
Switch
Partitions
(Multi-Root)
NTB
ports
(Multi-Root
IO)
DMA
Controllers
Multicast
ARID/ACS
Atomics/TPH
LTR/OBFF
Adaptive
Cut-through
Multi-Domain
Clocking
Request
Metering
Temperature
Sensor
Package
Size
(mm)
89H64H16G3
3
64
16
3
16
3
35x35
89H48H12G3
3
48
12
3
12
3
27x27
89H32H8G3
3
32
8
3
8
3
23x23
89H32NT24AG2
2
32
24
8
2
3
8
3
23x23
89H32NT8AG2
2
32
8
2
3
8
3
23x23
89H24NT6AG2
2
24
6
2
3
6
3
23x23
89H24NT24G2
2
24
8
2
3
2
3
23x23
89H16NT16G2
2
16
4
2
3
2
3
19x19
89H12NT12G2
2
12
3
2
3
2
3
19x19
89HPES8T5A
1
8
5
15x15
89HPES5T5
1
5
15x15
89HPES4T4
1
4
15x15
89HPES3T3
1
3
10x10
相關(guān)PDF資料
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