Symbol1
參數(shù)資料
型號(hào): IDT79RC32K438-300BBG
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 14/59頁
文件大?。?/td> 0K
描述: IC MPU 32BIT CORE 300MHZ 416-BGA
標(biāo)準(zhǔn)包裝: 40
系列: Interprise™
處理器類型: MIPS32 32-位
速度: 300MHz
電壓: 1.3V
安裝類型: 表面貼裝
封裝/外殼: 416-BGA
供應(yīng)商設(shè)備封裝: 416-PBGA(27x27)
包裝: 托盤
其它名稱: 79RC32K438-300BBG
21 of 59
May 25, 2004
IDT 79RC32438
Figure 5 Warm Reset AC Timing Waveform
Signal
Symbol1
1. In the DDR data sheet: Tskew_7g = tDQSQ; Tdo_7k = tDH, tDS; Tdo_7l = tDH, tDS; Tac = tAC; Tdo_7m = tIH, tIS.
Referenc
e Edge
200MHz 233MHz 266MHz 300MHz
Unit Conditions
Timing
Diagram
Reference
Min
Max
Min
Max
Min
Max
Min
Max
Memory Bus - DDR Access
DDRDATA[31:0]
Tskew_7g2
2. Meets DDR timing requirements for DDR 266 SDRAMs with 400 ps remaining margin to compensate for PCB propagation mismatches, which is adequate to guarantee functional
timing, provided the RC32438 DDR layout guidelines are followed.
DDRDQSx
0.0
0.9
0.0
0.9
0.0
0.9
0.0
0.8
ns
See Figures 6
and 7.
Tdo_7k3
3. Setup times are calculated as applicable clock period - Tdo max. For example, if the DDR is running at 266MHz, it uses a 133MHz input clock. The period for a 133MHz clock is
7.5ns. If the Tdo max value is 4.5ns, the TIS parameter is 7.5ns minus 4.5ns = 3ns. The DDR spec for this parameter is 1ns, so there is 2ns of slack left over for board propagation.
Calculations for TDS are similar, but since this parameter is taken relative to the DDRDQS signals, which are referenced on both edges, the effective period with a 133MHz input
clock is only 3.75ns. So, if the max Tdo is 2.7ns, we have 3.75ns minus 2.7ns = 1.05ns for TDS. The DDR data sheet specs a value of 0.5ns for 266MHz, so this leaves 0.55ns slack
for board propagation delays.
1.5
3.3
1.1
2.9
0.9
2.7
0.7
2.4
ns
DDRDM[7:0]
Tdo_7l
DDRDQSx
1.5
3.3
1.1
2.9
0.9
2.7
0.7
2.4
ns
DDRDQS[3:0]
Tac
DDRCKPx
-0.75 0.75 -0.75 0.75 -0.75 0.75 -0.75 0.75
ns
DDRADDR[13:0],
DDRBA[1:0],
DDRCASN, DDRCKE,
DDRCSN[1:0],
DDROEN[3:0],
DDRRASN, DDRWEN
Tdo_7m4
DDRCKPx
1.1
4.5
1.1
4.5
1.1
4.5
1.1
4.5
ns
Table 7 DDR SDRAM Timing Characteristics
1.
Warm reset caused by any of the conditions listed in the Warm Reset section of Chapter 3, Clocking and Initialization, in the RC32438 User Reference
Manual.
2.
The RC32438 tri-states the data bus, MDATA[15:0], and negates all memory control signals.
3.
The RC32438 negates RSTN.
4.
The RC32438 starts driving the data bus, MDATA[15:0], again, but does not sample the RSTN input.
5.
CPU begins executing by taking a MIPS soft reset exception and also starts sampling the RSTN input again.
Active
Deasserted
Active
CLK
COLDRSTN
RSTN
MDATA[15:0]
Mem Control Signals
>= 4096 CLK clock cycles
(RSTN ignored during this period
to allow pull-up to drive signal high)
FFFF_FFFF
1
2
3
4
5
EXTCLK
Tdz_6d
Tzd_6d
相關(guān)PDF資料
PDF描述
IDT79RC32T336-150BCG IC MPU 32BIT CORE 150MHZ 256-BGA
IDT79RC32T351-133DHG IC MPU 32BIT CORE 133MHZ 208-QFP
IDT79RC32V332-150DHG IC PROC 32BIT CPU 150MHZ 208-QFP
IDT79RC32V333-150DHG IC PROC 32BIT CPU 150MHZ 208-QFP
IDT79RC64T575-250DP IC MPU 64BIT EMB 250MHZ 208-QFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IDT79RC32T332-100DH 功能描述:IC MPU 32BIT CORE 100MHZ 208-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:Interprise™ 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
IDT79RC32T332-100DHI 功能描述:IC MPU 32BIT CORE 100MHZ 208-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:Interprise™ 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
IDT79RC32T332-133DH 功能描述:IC MPU 32BIT CORE 133MHZ 208-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:Interprise™ 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
IDT79RC32T332-133DHI 功能描述:IC MPU 32BIT CORE 133MHZ 208-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:Interprise™ 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
IDT79RC32T332-150DH 功能描述:IC MPU 32BIT CORE 1150MHZ 208-QF RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:Interprise™ 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤