參數(shù)資料
型號(hào): IDT70V3589S133DRI
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類(lèi): DRAM
英文描述: HIGH-SPEED 3.3V 128/64K x 36 SYNCHRONOUS DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE
中文描述: 64K X 36 DUAL-PORT SRAM, 15 ns, PQFP208
封裝: 28 X 28 MM, 3.50 MM, PLASTIC, QFP-208
文件頁(yè)數(shù): 15/15頁(yè)
文件大?。?/td> 190K
代理商: IDT70V3589S133DRI
6.42
IDT70V9379L
High-Speed 32K x 18 Dual-Port Synchronous Pipelined Static RAM
Industrial and Commercial Temperature Ranges
9
Timing Waveform with Port-to-Port Flow-Through Read(4,5,7)
Timing Waveform of a Bank Select Pipelined Read(1,2)
tSC
tHC
CE0(B1)
ADDRESS(B1)
A0
A1
A2
A3
A4
A5
tSA
tHA
CLK
4857 drw 08
Q0
Q1
Q3
DATAOUT(B1)
tCH2
tCL2
tCYC2
(3)
ADDRESS(B2)
A0
A1
A2
A3
A4
A5
tSA
tHA
CE0(B2)
DATAOUT(B2)
Q2
Q4
tCD2
tCKHZ
tCD2
tCKLZ
tDC
tCKHZ
tCD2
tCKLZ
(3)
tSC
tHC
(3)
tCKHZ
(3)
tCKLZ
(3)
tCD2
A6
tDC
tSC
tHC
tSC
tHC
DATAIN "A"
CLK "B"
R/
W "B"
ADDRESS "A"
R/
W "A"
CLK "A"
ADDRESS "B"
NO
MATCH
NO
MATCH
VALID
tCWDD
tCD1
tDC
DATAOUT "B"
4857 drw 09
VALID
tSW
tHW
tSA
tHA
tSD
tHD
tHW
tCD1
tCCS
tDC
tSA
tSW
tHA
(6)
NOTES:
1. B1 Represents Bank #1; B2 Represents Bank #2. Each Bank consists of one IDT70V9379 for this waveform, and are setup for depth expansion in this
example. ADDRESS(B1) = ADDRESS(B2) in this situation.
2.
UB, LB, OE, and ADS = VIL; CE1(B1), CE1(B2), R/W, CNTEN, and CNTRST = VIH.
3. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).
4.
CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH.
5.
OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to.
6. If tCCS < maximum specified, then data from right port READ is not valid until the maximum specified for tCWDD.
If tCCS > maximum specified, then data from right port READ is not valid until tCCS + tCD1. tCWDD does not apply in this case.
7. All timing is the same for both Left and Right ports. Port "A" may be either Left or Right port. Port "B" is the opposite from Port "A".
相關(guān)PDF資料
PDF描述
IDT70V3589S166BC HIGH-SPEED 3.3V 128/64K x 36 SYNCHRONOUS DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE
IDT72V2105 3.3 VOLT HIGH DENSITY CMOS SUPERSYNC FIFO 131,072 x 18 262,144 x 18
IDT72V8980 3.3 VOLT TIME SLOT INTERCHANGE DIGITAL SWITCH 256 x 256
IDT72V8980DB 3.3 VOLT TIME SLOT INTERCHANGE DIGITAL SWITCH 256 x 256
IDT72V8980J 3.3 VOLT TIME SLOT INTERCHANGE DIGITAL SWITCH 256 x 256
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IDT70V3589S166BC 功能描述:IC SRAM 2MBIT 166MHZ 256BGA RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR)
IDT70V3589S166BC8 功能描述:IC SRAM 2MBIT 166MHZ 256BGA RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR)
IDT70V3589S166BCG 功能描述:IC SRAM 2MBIT 166MHZ 256BGA RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:2,500 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(單線) 電源電壓:1.8 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-TSSOP,8-MSOP(0.118",3.00mm 寬) 供應(yīng)商設(shè)備封裝:8-MSOP 包裝:帶卷 (TR)
IDT70V3589S166BF 功能描述:IC SRAM 2MBIT 166MHZ 208FBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR)
IDT70V3589S166BF8 功能描述:IC SRAM 2MBIT 166MHZ 208FBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:3,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:1.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:帶卷 (TR)