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參數(shù)資料
型號: IDT2309NZ-1HPGGI
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 2/5頁
文件大?。?/td> 0K
描述: IC CLOCK BUFFER 1:9 16-TSSOP
產(chǎn)品培訓模塊: Clock Distibution and Generation 1.0
標準包裝: 96
類型: 扇出緩沖器(分配)
電路數(shù): 1
比率 - 輸入:輸出: 1:9
差分 - 輸入:輸出: 無/無
輸入: LVTTL
輸出: LVTTL
頻率 - 最大: 133.33MHz
電源電壓: 3 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-TSSOP(0.173",4.40mm 寬)
供應商設備封裝: 16-TSSOP
包裝: 管件
產(chǎn)品目錄頁面: 1254 (CN2011-ZH PDF)
其它名稱: 2309NZ-1HPGGI
800-1306
800-1306-5
800-1306-ND
2
COMMERCIALANDINDUSTRIALTEMPERATURERANGES
IDT2309NZ
NINEOUTPUT3.3VCLOCKBUFFER
PIN CONFIGURATION
SOIC/ TSSOP
TOP VIEW
BUF_IN
OUTPUT1
VDD
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1
OUTPUT2
GND
OUTPUT3
OUTPUT9
OUTPUT8
GND
VDD
OUTPUT4
OUTPUT5
OUTPUT6
OUTPUT7
PIN DESCRIPTION
Pin Name
Pin Number
Functional Description
VDD
4, 8, 13
3.3V Digital Voltage Supply
GND
5, 9, 12
Ground
BUF_IN
1
Input clock
OUTPUT[1:9]
2, 3, 6, 7, 10
Outputs
11, 14, 15, 16
Symbol
Parameter
Min.
Max.
Unit
VDD
Supply Voltage
3
3.6
V
TA
OperatingTemperature(AmbientTemperature)
0
70
°C
CL
Load Capacitance, FOUT < 100MHz
30
pF
Load Capacitance 100MHz < FOUT < 133.33MHz
15
CIN
InputCapacitance
7
pF
BUF_IN, SDRAM[1:9]
OperatingFrequency
DC
133.33
MHz
OPERATING CONDITIONS - COMMERCIAL
Symbol
Rating
Max.
Unit
VDD
Supply Voltage Range
–0.5 to +4.6
V
VI(2)
Input Voltage Range (REF)
–0.5 to +5.5
V
VI
InputVoltageRange
–0.5 to
V
(except REF)
VDD+0.5
IIK (VI < 0)
Input Clamp Current
–50
mA
IO (VO = 0 to VDD)
ContinuousOutputCurrent
±50
mA
VDD or GND
ContinuousCurrent
±100
mA
TA = 55°C
Maximum Power Dissipation
0.7
W
(in still air)(3)
TSTG
StorageTemperatureRange
–65 to +150
°C
Operating
CommercialTemperature
0 to +70
°C
Temperature
Range
Operating
IndustrialTemperature
-40 to +85
°C
Temperature
Range
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. The input and output negative-voltage ratings may be exceeded if the input and output
clamp-current ratings are observed.
3. The maximum package power dissipation is calculated using a junction temperature
of 150°C and a board trace length of 750 mils.
ABSOLUTE MAXIMUM RATINGS(1)
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