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參數(shù)資料
| 型號(hào)： | ICS874S02AMI |
| 元件分類(lèi)： | 時(shí)鐘及定時(shí) |
| 英文描述： | 874S SERIES, PLL BASED CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO20 |
| 封裝： | 7.50 X 12.80 MM, 2.30 MM HEIGHT, MS-013, MO-119, SOIC-20 |
| 文件頁(yè)數(shù)： | 4/15頁(yè) |
| 文件大?。?/td> | 200K |
| 代理商： | ICS874S02AMI |
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874S02AMI
www.icst.com/products/hiperclocks.html
REV. A APRIL 27, 2006
12
Integrated
Circuit
Systems, Inc.
ICS874S02I
1:1 DIFFERENTIAL-TO-LVDS
ZERO DELAY CLOCK GENERATOR
PRELIMINARY
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS874S02I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS874S02I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD = 3.3V + 5% = 3.465V, which gives worst case results.
Power (core)
MAX = VDD_MAX * (IDD_MAX + IDDA_MAX) = 3.465V * (84mA + 18mA) = 353.43mW
Power (outputs)
MAX = VDDO_MAX * IDDO_MAX = 3.465V * 30mA = 103.95mW
Total Power
_MAX = 353.43mW + 103.95mW = 457.38mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
q
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used.
Assuming a moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 39.7°C/W per
Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.457W * 39.7°C/W = 103.1°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air
flow, and the type of board (single layer or multi-layer).
TABLE 7. THERMAL RESISTANCE
θθθθθ
JA
FOR
20-LEAD SOIC, FORCED CONVECTION
θθθθθ
JA by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
83.2°C/W
65.7°C/W
57.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
46.2°C/W
39.7°C/W
36.8°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ICS874S02BMI | 制造商:Integrated Device Technology Inc 功能描述:IC CLK GENERATOR ZDB 20SOIC |
| ICS874S02BMILF | 功能描述:IC CLK GEN 1:1 DIFF ZD 20SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™ 標(biāo)準(zhǔn)包裝:27 系列:Precision Edge® 類(lèi)型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無(wú)/是 頻率 - 最大:800MHz 除法器/乘法器:是/無(wú) 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
| ICS874S02BMILFT | 功能描述:IC CLK GEN 1:1 DIFF ZD 20SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™ 標(biāo)準(zhǔn)包裝:1,000 系列:- 類(lèi)型:時(shí)鐘/頻率合成器，扇出分配 PLL:- 輸入:- 輸出:- 電路數(shù):- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 除法器/乘法器:- 電源電壓:- 工作溫度:- 安裝類(lèi)型:表面貼裝 封裝/外殼:56-VFQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:56-VFQFP-EP（8x8） 包裝:帶卷 (TR) 其它名稱(chēng):844S012AKI-01LFT |
| ICS874S02BMIT | 制造商:Integrated Device Technology Inc 功能描述:IC CLK GENERATOR ZDB 20SOIC |
| ICS874S336AGLF | 功能描述:IC CLOCK MULTIPLIER LVDS 20TSSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™ 標(biāo)準(zhǔn)包裝:27 系列:Precision Edge® 類(lèi)型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無(wú)/是 頻率 - 最大:800MHz 除法器/乘法器:是/無(wú) 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
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