參數(shù)資料
型號: ICS8732AYI-01T
元件分類: 時鐘及定時
英文描述: 8732 SERIES, PLL BASED CLOCK DRIVER, 8 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP52
封裝: 10 X 10 MM, 1.40 MM HEIGHT, MS-026, LQFP-52
文件頁數(shù): 4/16頁
文件大?。?/td> 160K
代理商: ICS8732AYI-01T
8732AYI-01
www.icst.com/products/hiperclocks.html
REV. A AUGUST 9, 2005
12
Integrated
Circuit
Systems, Inc.
ICS8732I-01
LOW VOLTAGE, LOW SKEW
3.3V LVPECL CLOCK GENERATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8732I-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8732I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.465V * 165mA = 572mW
Power (outputs)
MAX = 30.2mW/Loaded Output pair
If all outputs are loaded, the total power is 10 * 30.2mW = 302mW
Total Power
_MAX (3.465V, with all outputs switching) = 572mW + 302mW = 874mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 36.4°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.874W * 36.4°C/W = 116.8°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθθθθ
JA by Velocity (Linear Feet per Minute)
Table 7. Thermal Resistance
θθθθθ
JA for 52-pin LQFP, Forced Convection
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
58.0°C/W
47.1°C/W
42.0°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
42.3°C/W
36.4°C/W
34.0°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
相關(guān)PDF資料
PDF描述
ICS8732AYI-01LFT 8732 SERIES, PLL BASED CLOCK DRIVER, 8 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP52
ICS8732AYI-01LF 8732 SERIES, PLL BASED CLOCK DRIVER, 8 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP52
ICS8732AYI-01LFT 8732 SERIES, PLL BASED CLOCK DRIVER, 8 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP52
ICS87332AMI-01T 87332 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO8
ICS87332AMI-01LFT 87332 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO8
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