參數(shù)資料
型號: ICS873033AMLF
英文描述: HIGH SPEED, ±4 DIFFERENTIAL-TO- 3.3V, 5V LVPECL/ECL CLOCK GENERATOR
中文描述: 高速,± 4差分至為3.3V,5V的LVPECL / ECL時鐘發(fā)生器
文件頁數(shù): 11/16頁
文件大?。?/td> 261K
代理商: ICS873033AMLF
873033AM
www.icst.com/products/hiperclocks.html
REV. A OCTOBER 19, 2005
11
Integrated
Circuit
Systems, Inc.
ICS873033
H
IGH
S
PEED
, ÷4 D
IFFERENTIAL
-
TO
-
3.3V, 5V
LVPECL/ECL C
LOCK
G
ENERATOR
P
OWER
C
ONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS873033.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS873033 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
= 5.5V, which gives worst case results.
NOTE:
Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 5.5V * 30mA =
165mW
Power (outputs)
MAX
=
30.94mW/Loaded Output pair
Total Power
_MAX
(5.5V, with all outputs switching) =
165mW + 30.94mW =
195.94mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM
devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA
* Pd_total + T
A
Tj = Junction Temperature
θ
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 103.3°C/W per Table 6A below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.196W * 103.3°C/W = 105.2°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
153.3°C/W
112.7°C/W
128.5°C/W
103.3°C/W
115.5°C/W
97.1°C/W
NOTE:
Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
T
ABLE
6A. T
HERMAL
R
ESISTANCE
θ
JA
FOR
8-
PIN
SOIC, F
ORCED
C
ONVECTION
T
ABLE
6B. T
HERMAL
R
ESISTANCE
θ
JA
FOR
8-
PIN
TSSOP, F
ORCED
C
ONVECTION
θ
JA
by Velocity (Meters per Second)
0
1
2
Multi-Layer PCB, JEDEC Standard Test Boards
101.7°C/W
90.5°C/W
89.8°C/W
相關(guān)PDF資料
PDF描述
ICS873033AMLFT HIGH SPEED, ±4 DIFFERENTIAL-TO- 3.3V, 5V LVPECL/ECL CLOCK GENERATOR
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