參數(shù)資料
型號: ICS853006
英文描述: DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
中文描述: DIFFERENTIAL-TO-2.5V/3.3V的LVPECL / ECL扇出緩沖器
文件頁數(shù): 12/16頁
文件大?。?/td> 202K
代理商: ICS853006
853006AG
www.icst.com/products/hiperclocks.html
REV. A AUGUST 18, 2004
1
2
Integrated
Circuit
Systems, Inc.
ICS853006
L
OW
S
KEW
, 1-
TO
-6
D
IFFERENTIAL
-
TO
-2.5V/3.3V LVPECL/ECL F
ANOUT
B
UFFER
P
OWER
C
ONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS853006.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS853006 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.465V, which gives worst case results.
NOTE:
Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 115mA =
398.48mW
Power (outputs)
MAX
=
30.94mW/Loaded Output pair
If all outputs are loaded, the total power is 6 * 30.94mW =
185.64mW
Total Power
_MAX
(3.465V, with all outputs switching) =
398.48mW + 185.64mW =
584.12mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM
devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA
* Pd_total + T
A
Tj = Junction Temperature
θ
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
must be used
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.
. Assuming a
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.584W * 66.6°C/W = 123.9°C. This is below the limit of 125°C
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
114.5°C/W
73.2°C/W
98.0°C/W
66.6°C/W
88.0°C/W
63.5°C/W
NOTE:
Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
T
ABLE
6. T
HERMAL
R
ESISTANCE
θ
JA
FOR
20-
PIN
TSSOP, F
ORCED
C
ONVECTION
相關(guān)PDF資料
PDF描述
ICS853006AG DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
ICS853006AGT DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
ICS853011BMLF LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
ICS853011BMLFT LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
ICS853011BM LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-2.5V/3.3V LVPECL/ECL FANOUT BUFFER
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