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參數(shù)資料
| 型號(hào)： | ICS844246BGLFT |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | 時(shí)鐘產(chǎn)生/分配 |
| 英文描述： | 333.3333 MHz, OTHER CLOCK GENERATOR, PDSO24 |
| 封裝： | 4.40 X 7.80 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, MO-153, TSSOP-24 |
| 文件頁(yè)數(shù)： | 3/16頁(yè) |
| 文件大?。?/td> | 977K |
| 代理商： | ICS844246BGLFT |
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IDT / ICS LVDS FREQUENCY SYNTHESIZER W/FANOUT BUFFER
11
ICS844246BG REV.C NOVEMBER 14, 2007
ICS844246
FEMTOCLOCKS CRYSTAL-TO-LVDS FREQUENCY SYNTHESIZER W/INTEGRATED FANOUT BUFFER
PRELIMINARY
FIGURE 5. ASSEMBLY FOR EXPOSED PAD THERMAL RELEASE PATH –SIDE VIEW (DRAWING NOT TO SCALE)
EPAD THERMAL RELEASE PATH
In order to maximize both the removal of heat from the package
and the electr ical perfor mance, a land patter n must be
incorporated on the Printed Circuit Board (PCB) within the footprint
of the package corresponding to the exposed metal pad or
exposed heat slug on the package, as shown in Figure 5. The
solderable area on the PCB, as defined by the solder mask, should
be at least the same size/shape as the exposed pad/slug area on
the package to maximize the thermal/electrical performance.
Sufficient clearance should be designed on the PCB between the
outer edges of the land pattern and the inner edges of pad pattern
for the leads to avoid any shorts.
While the land pattern on the PCB provides a means of heat
transfer and electrical grounding from the package to the board
through a solder joint, thermal vias are necessary to effectively
conduct from the surface of the PCB to the ground plane(s). The
land pattern must be connected to ground through these vias.
The vias act as “heat pipes”. The number of vias (i.e. “heat pipes”)
are application specific and dependent upon the package power
dissipation as well as electrical conductivity requirements. Thus,
thermal and electrical analysis and/or testing are recommended
to determine the minimum number needed. Maximum thermal
and electrical performance is achieved when an array of vias is
incorporated in the land pattern. It is recommended to use as
many vias connected to ground as possible. It is also
recommended that the via diameter should be 12 to 13mils (0.30
to 0.33mm) with 1oz copper via barrel plating. This is desirable to
avoid any solder wicking inside the via during the soldering process
which may result in voids in solder between the exposed pad/
slug and the thermal land. Precautions should be taken to
eliminate any solder voids between the exposed heat slug and
the land pattern. Note: These recommendations are to be used
as a guideline only. For further information, refer to the Application
Note on the Surface Mount Assembly of Amkor’s Thermally/
Electrically Enhance Leadfame Base Package, Amkor Technology.
GROUND PLANE
LAND PATTERN
SOLDER
THERMAL VIA
EXPOSED HEAT SLUG
(GROUND PAD)
PIN
PIN PAD
SOLDER
PIN
PIN PAD
SOLDER
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ICS844246DGLF | 功能描述:IC SYNTHESIZER/BUFFER 24TSSOP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™, FemtoClock™ 標(biāo)準(zhǔn)包裝:27 系列:Precision Edge® 類型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無(wú)/是 頻率 - 最大:800MHz 除法器/乘法器:是/無(wú) 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
| ICS844246DGLFT | 功能描述:IC SYNTHESIZER/BUFFER 24TSSOP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™, FemtoClock™ 標(biāo)準(zhǔn)包裝:1,000 系列:- 類型:時(shí)鐘/頻率合成器，扇出分配 PLL:- 輸入:- 輸出:- 電路數(shù):- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 除法器/乘法器:- 電源電壓:- 工作溫度:- 安裝類型:表面貼裝 封裝/外殼:56-VFQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:56-VFQFP-EP（8x8） 包裝:帶卷 (TR) 其它名稱:844S012AKI-01LFT |
| ICS844251BG-14LF | 功能描述:IC CLOCK GENERATOR ETH 8TSSOP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™, FemtoClock™ 標(biāo)準(zhǔn)包裝:27 系列:Precision Edge® 類型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無(wú)/是 頻率 - 最大:800MHz 除法器/乘法器:是/無(wú) 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
| ICS844251BG-14LFT | 功能描述:IC CLOCK GENERATOR ETH 8TSSOP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™, FemtoClock™ 標(biāo)準(zhǔn)包裝:27 系列:Precision Edge® 類型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無(wú)/是 頻率 - 最大:800MHz 除法器/乘法器:是/無(wú) 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
| ICS844251BGI-14LF | 制造商:Integrated Device Technology Inc 功能描述:IC SYNTHESIZER LVDS 8TSSOP |
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